APRIL 9, 2002, 12:00 EDT
WEST CALDWELL, N.J. -- Merrimac Industries, Inc. has received a contract from Lockheed Martin Corporation NE&SS-Surface Systems to provide a subsystem for use in their High Band Multifunction Receive System (HBMRS). The Multifunction Receive System is part of the RF System Advanced Technology Program, whose technology goals include radar, electronic warfare, and communications functions sharing a common antenna.
Mason N. Carter, Chairman and CEO of Merrimac commented, "Our innovative approach with Lockheed Martin's Design and Merrimac's Development Process of removing the heat generated in the resistors was a joint development project by the Merrimac RF Microwave Products Group and our wholly-owned subsidiary Filtran Microcircuits Inc. Filtran conducted the etching, sputtering and plating while the RF Microwave Products Group installed the chip resistors inside the multilayer power divider assembly to provide the desired isolation. In addition, small, edge-launched connectors were installed to meet the Lockheed Martin specification. This project clearly demonstrates the synergy between Merrimac and Filtran and how by combining capabilities Merrimac can bring added value to our customers."
Carter continued, "The application requires multiple four-way power dividers to be integrated in a compact module that meets demanding environmental requirements for shipboard operations. Our design will be utilized in critical mission defense functions, and will assist in the integration of a common set of RF antenna apertures that operate efficiently over a broad spectral bandwidth."
NE&SS-Surface Systems is one of five major lines of businesses comprising the Lockheed Martin NE&SS business segment. NE&SS provides surface ship and submarine weapon systems, antisubmarine warfare and ocean surveillance systems, missile launching systems, radar and sensor systems, ship systems integration services and other advanced systems and services to customers worldwide. NE&SS is a unit of Lockheed Martin Corporation headquartered in Bethesda, MD. The corporation's principal business areas are aeronautic, space, systems integration and technology services.
Merrimac Industries, Inc. is a leader in the design and manufacture of Multi-Mix PICO RF Microwave components, assemblies and micro-multifunction modules (MMFM), serving the wireless telecommunications industry worldwide with enabling technologies for commercial applications. Merrimac is focused on providing Total Integrated Packaging Solutions with Multi-Mix Microtechnology, a leading edge competency providing value to our customers through miniaturization and integration.
The Multi-Mix process for microwave, multilayer integrated MMFM circuitry is a patented method developed by Merrimac Industries based on fluoropolymer composite substrates. The fusion bonding of multilayer structures provides a homogeneous dielectric medium for superior electrical performance at microwave frequencies. The bonded layers may incorporate embedded semiconductor devices, MMICs, etched resistors, passive circuit elements and plated-through via holes to form a three-dimensional subsystem enclosure that requires no further packaging. Merrimac Industries facilities are registered under ISO 9000, an internationally developed set of quality criteria for manufacturing operations.
Merrimac Industries, Inc. and its subsidiary Filtran Microcircuits Inc., with locations in West Caldwell, NJ, San Jose, Costa Rica and Ottawa, Ontario, Canada, have approximately 240 co-workers dedicated to the design and manufacture of signal processing components, gold plating of high-frequency microstrip, bonded stripline and thick metal-backed Teflon (PTFE) micro-circuitry and subsystems providing Total Integrated Packaging Solutions for wireless applications. Merrimac (MRM) is listed on the American Stock Exchange. Multi-Mix, Multi-Mix PICO, MMFM and Total Integrated Packaging Solutions are trademarks of Merrimac Industries, Inc.
Military & Aerospace Electronics