GD Awarded $2B For Combat Systems Vehicle Design

STERLING HEIGHTS, Mich., December 16, 2003 ..General Dynamics Land Systems awarded a $2B contract by Boeing for engineering development and demonstration of a family of manned ground vehicles for the U.S. Army's Future Combat Systems (FCS) program. To date, General Dynamics has been awarded contracts valued at approximately $2.5B for FCS-related work.

"We are happy to be a significant member of the team selected to develop the next generation of manned ground vehicles," said Charles M. Hall, president of General Dynamics Land Systems. "We are committed to supporting the Army and the Lead Systems Integrator team, Boeing and Science Applications International Corporation, to achieve a successful outcome for the development phase of Future Combat Systems."

Mike Bolon, General Dynamics Land Systems senior vice president of engineering, design and development, said, "The program's systems of systems approach brings advanced technologies to the soldiers of the future, allowing them to operate across the full spectrum of combat operations. This subcontract results in one team -- the U.S. Army, its Lead Systems Integrator team, United Defense Limited Partnership and General Dynamics -- working to design, develop and demonstrate a new fleet of armored combat vehicles."

Under this contract General Dynamics is leading the Manned Ground Vehicle common design team through engineering development, testing and demonstration of prototypes. Manned Ground Vehicles will be a new generation of Army combat vehicles replacing today's tanks, artillery and infantry carriers. General Dynamics is also responsible for the development and integration of the Mounted Combat System, Command and Control Vehicle, and Reconnaissance and Surveillance Vehicle through 2009.

General Dynamics and United Defense Limited Partnership, which received a similar subcontract, together have formed an integrated design team to develop and demonstrate a family of eight manned ground vehicles sharing common components and subsystems. These new vehicles will be significantly smaller and lighter than the systems they replace, and designed to fit into a C-130 airplane.

The Army and its Lead Systems Integrator team (Boeing and Science Applications International Corporation) in May began the system development and demonstration phase of FCS, a joint, networked 'system of systems' that comprises 18 manned and unmanned ground and aerial vehicles and sensors connected via an advanced communications network.

General Dynamics, headquartered in Falls Church, Virginia, employs approximately 66,900 people worldwide and anticipates 2003 revenues of $16.1 billion. The company has leading market positions in land and amphibious combat systems, mission-critical information systems and technologies, shipbuilding and marine systems, and business aviation.

More information can be found at www.generaldynamics.com .

Military & Aerospace Electronics


Military & Aerospace Photos

Most Popular Articles

Related Products

VPX3-453 3U VPX Virtex-6/8640D Digital Signal Processor

The Curtiss-Wright VPX3-453 is a high performance 3U VPX DSP and FPGA processor card that combine...

CHAMP-FX4 6U OpenVPX Virtex-7 FPGA Processor Card

The CHAMP-FX4 is the flagship 6U product in Curtiss-Wright Defense Solutions’ family of user-prog...

PMC-E2001 Audio/Acoustic Waveform Generating PMC Card

PMC-E2001 Delta-sigma PMC features 16-bit resolution with 8 Analog Outputs and 4 Analog Inputs wi...

PC/104 SBC and Peripherals

Kontron PC/104 Standalone Single Board Computers (SBCs) serve in every format, even with consiste...

General Micro "Horizon" C299

The C299 Horizon is a third generation, 6U cPCI SBC module based on GMS’ upgradable CPU technolog...

Rugged Mobile Communications Server

Advanced communications server designed to be deployed in environments where it needs to meet cer...

RR2P Removable Canister RAID System

Transportable data storage for mobile field use aboard planes, ships and ground transport. 2U, du...

API DC Link Power Film Capacitors

High reliability DC link capacitors for power inverter applications which require superior life e...

Interpoint™ MTR Series™ 50 Volt

The MTR Series™ MTR 50, 28 volt dc-dc converter offers up to 30 watts of output power from single...

Interpoint™ MFP Series™ Down-Leaded Point of Load

The new down-leaded version of its Interpoint™ MFP Series Point of Load (POL) converters are avai...

Related Companies

Curtiss-Wright Defense Solutions

About Curtiss-Wright Defense Solutions Curtiss-Wright Defense Solutions (CWDS) is a long established techno...

Kontron

Driving the world’s embedded computing platforms Kontron is a global leader in embedded computing technology.&n...

General Micro Systems Inc

Since 1979, General Micro Systems has been providing the most diverse line of single-board computers in the industry....

Elma Electronic Inc

Who we are...   About Elma Electronic Systems   The Systems division of Elma Electronic Inc. supplies the

Winchester Systems Inc

At its founding in 1981, Winchester Systems introduced its first 5 MB disk system for Intel development system users....

API Technologies Corp

Who We Are API Technologies is a dominant technology provider of RF/microwave, microelectronics, and security technol...

Extreme Engineering Solutions Inc (X-ES)

 Extreme Engineering Solutions, Inc. (X-ES) is a leader in the design, manufacture, and support of standard and ...

Raycom Electronics

Raycom Electronics, Inc., a subsidiary of Electro Technik Industries (ETI), was incorporated in 1965.  The compa...

Crane Aerospace & Electronics

When failure is NOT an option...rely on Crane Aerospace & Electronics. We supply high-density, high-reliability c...

LEMO USA Inc

Provides a lightweight, compact aluminum connector. M-series connector is focused on the design that requires a MIL-3...
Wire News provided by   

Press Releases

One Component, Snap Cure Epoxy Features High Strength Properties

Suitable for a variety of applications in the electronic, aerospace and OEM industries, Master Bond EP3SP5F...

One Part Epoxy Resists up to 500°F and Meets NASA Low Outgassing Specifications

Master Bond Supreme 12AOHT-LO is a one component epoxy for a variety of bonding and sealing applications in...

Low Viscosity, One Part Cyanoacrylate Is Non-Toxic and Meets ISO 10993-5 Specifications

Master Bond MB250NT is widely used for a variety of applications ranging from repair to high speed producti...

Thermally Conductive, Two Component Epoxy Passes USP Class VI Tests and ISO 10993-5 Specifications

With biocompatibility and cytotoxicity certifications, Master Bond EP21AOLV-2Med is often selected for bond...

CURTISS-WRIGHT CONGRATULATES NORTHROP GRUMMAN ON SUCCESSFUL FIRST FLIGHT OF SECOND MQ-4C TRITON UAS

Curtiss-Wright Corporation’s Defense Solutions division applauds Northrop Grumman Corporation (NYSE: NOC) o...

Curtiss-Wright’s New Rugged Mobile IP Router Subsystem Features an Integrated Cisco® 5915 ESR Router

Curtiss-Wright Corporation today announced that its Defense Solutions division, a Cisco® Systems Solution T...

VICTORY Shared Processing, Fire Control Computer, and Switch for Ground Vehicles Introduced by Curtiss-Wright

Curtiss-Wright Corporation today announced that its Defense Solutions division has introduced a new fully i...

GE Announces First Sub-Credit Card-Sized Multi-Function High Definition (HD) Video Tracker

HUNTSVILLE, AL.— OCTOBER 13, 2014—GE’s Intelligent Platforms business today announced at AUSA (October 13-...

Webcasts

Meeting the Gen3 backplane challenge with OpenVPX and COTS

Tight Pentagon budgets mean military systems must stay in the field for longer than ever before. This doesn't mean obsolete technology, however. Today's military electronics are being upgraded constantly, an...
Sponsored by:

Design Strategy Considerations for DO-178C Certified Multi-core Systems

Join Wind River to learn how system architecture and design choices can minimize your DO-178C certification challenges.

Sponsored by:

Flying, Sailing or Driving - The Rugged, Embedded Intel-based Server that goes where you need it!Flying Sailing or Driving

Leveraging the power of server-class processors is no longer relegated to the confines of data centers. Through several innovations, Mercury Systems has ruggedized Intel’s server-class chips for deployment. ...
Sponsored by:

All Access Sponsors


Mil & Aero Magazine

April 2015
Volume 26, Issue 4
file

Download Our Apps



iPhone

iPad

Android

Follow Us On...



Newsletters

Military & Aerospace Electronics

Weekly newsletter covering technical content, breaking news and product information
SUBSCRIBE

Cyber Security

Monthly newsletter covering cyber warfare, cyber security, information warfare, and information security technologies, products, contracts, and procurement opportunities
SUBSCRIBE

Defense Executive

Monthly newsletter covering business news and strategic insights for executive managers
SUBSCRIBE

Electronic Warfare

Quarterly newsletter covering technologies and applications in electronic warfare, cyber warfare, optical warfare, and spectrum warfare.
SUBSCRIBE

Embedded Computing Report

Monthly newsletter covering news on embedded computing in aerospace, defense and industrial-rugged applications
SUBSCRIBE

Unmanned Vehicles

Monthly newsletter covering news updates for designers of unmanned vehicles
SUBSCRIBE