HUDSON, Mass., 16 Feb. 2007. Hypertronics, a provider of high-performance electrical connector and interconnect solutions, has announced a new micro-miniature connector technology optimized for high-reliability military/aerospace applications.
Leveraging a contact system licensed from Ardent Concepts, the new HyperGrid technology features:
-- Ardent Concepts' RC Springprobe contact technology
-- Solderless, compression-style connections requiring 20 grams of force per node to maintain connectivity, with a contact pitch as low as 0.4 mm, ideal for high-density designs
-- AC performance, with multi-GHz bandwidth, exceptional signal integrity and consistent DC resistance
-- Durability, that exceeds 100k compression cycles, with excellent shock-and-vibration performance.
HyperGrid technology results in interconnect solutions that offer the same tiny form factor, high node count, and stackability features required in many micro-miniature applications, without the electrical, repeatability, or cost limitations associated with other technologies such as pogo pins, fuzz buttons, and conductive elastomers.
The new scalable HyperGrid technology will be available as custom interconnects for PCB-to-PCB, flex cable-to-PCB, and IC-to-PCB designs.
This new form factor opens portable, handheld, avionic, and other space and weight constrained applications to the high-reliability, repeatability, and rugged designs of Hypertronics. The license agreement with Ardent Concepts is exclusive for military/aerospace applications allowing Hypertronics to provide specialized mil/aero customers a unique interconnect solution not available with any other vendor.