Department of Defense contracts Endicott Interconnect Technologies to research, develop electronics packaging technologies

ENDICOTT, N.Y., 30 May 2007. The U.S. Department of Defense (DoD) has awarded Endicott Interconnect Technologies Inc. a $49 million follow-on production contract that includes a $5 million contract for research and development of electronics packaging technologies, including printed circuit boards (PCBs) and substrates for the next generation of high-productivity computing.

EI has met the DoD qualification requirements for its PCB, module. and processing blade production. This contract serves as the first of a three-phased, five-year program that uses EI as a DoD research arm for exploring new, high-speed electronics technologies.

Phase one includes system development and preliminary PCB and substrate design, along with fabrication of test vehicles for evaluating alternative material sets.

Phase two and three will be addressed in follow-on awards that encompass modifications to existing facilities to accommodate next-generation processing equipment for advanced technology, PCBs, substrates, and assembly.


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April 2015
Volume 26, Issue 4
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