ITT develops high-temperature micro connector for harsh environments

SANTA ANA, Calif., 21 April 2008. ITT Interconnect Solutions in Santa Ana, Calif., has developed high-temperature micro connectors for harsh operating conditions. The MDM Series connectors operate in temperatures as hot as 200 degrees Celsius and can be terminated in daisy-chain configurations within complex electronic instrumentation packages.

Typical applications include geophysical and oil exploration, electronic instrumentation and down-hole mapping. The connectors are made from high-temperature materials such as LCP (liquid crystalline polymer) thermoplastic. A D-subminiature connector based on PPS (polyphenylene sulfide) thermoplastic can also be integrated into the assembly.

The micro connectors offer a combination of 1.27- and 2.54-millimeter spacing, and feature a twist pin contact system and crimped gold plated contacts. For more information contact ITT Interconnect online at www.ittcannon.com.


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Mil & Aero Magazine

February 2015
Volume 26, Issue 2
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