LIBERTY LAKE, Wash., 22 April 2008. SprayCool, developer of advanced thermal-management solutions for the military, won a contract from General Dynamics to supply additional enclosures for the Command Variant of the U.S.M.C. Expeditionary Fighting Vehicle (EFV).

The units will be used to support ongoing hardware/software integration efforts throughout the current System Design and Demonstration (SDD) phase.

The Multi-Processor Unit (MPU), which SprayCool is under contract to provide, is the heart of the EFV's command-and-control capability.

The Command variant of the USMC EFV uses high-end commercial-grade electronics in a SprayCool enclosure to deliver mission processing demands.

The commercial boards in the SprayCool MPU--originally designed to be air-cooled--include five servers, a switch, an I/O board, and two expansion cards.

The SprayCool MPU's are fully rugged, sealed enclosures that enable commercial boards to meet the temperature, vibration, and EMI requirements of MIL-STD 810F and MIL-STD 461, and have been tested in the EFV vehicle environment.

The SprayCool 9-slot enclosure uses the company's patented 2-phase, liquid-cooling technology for maximum environmental control and flexibility, and can operate in temperatures ranging from -40 degrees C to +60 degrees C.

The product is upgradeable, capable of accepting a wide range of card types within the same chassis, simplifying the technology refresh cycle. It provides years of thermal headroom, considering it is capable of supporting cards sets of almost twice the power and thermal load as those deployed today. The EFV program has leveraged this feature during development, with new cards and capabilities added almost every 2 years with minimal NRE expense, saving the program costs and schedule.