SANTA ANA, Calif., 23 Dec. 2008. ITT Interconnect Solutions developed a mixed signal connector, providing a complete turnkey solution for carrying high and low voltage signals in the same interconnect package. Designated the Mixed Signal HV MDM Series, the connector is the newest addition to ITT's line of MDM Series micro high density connectors.

"The Mixed Signal HV MDM connector features a high-voltage contact system with isolation towers," says Keith Teichmann, director of marketing for ITT Interconnect Solutions. "Specialized silicone sealing has also been integrated to accommodate multiple voltage outputs, as well as advanced materials to prevent electrical arching between contacts in high altitude conditions."

The Mixed Signal HV MDM connector is targeted for use in harsh environments, including avionics and aircraft systems, radar applications, and launch vehicle systems.

The turnkey interconnect configuration features high voltage contacts capable of carrying as much as 2000 VDC, while ITT's twist pin contact system is used for low voltage signals. The contacts are crimped and gold-plated, with a combination of 1.27 millimeters (0.050 inches) and 0.254 millimeters (0.100 inches) spacing. The connector is housed in a straight board mount receptacle for simple assembly.

ITT Interconnect Solutions is an international manufacturer and supplier of connectors including circular, rectangular, fiber optic, RF, power and high voltage, audio, PCMCIA, compact flash card, enclosures, cable assemblies, and application specific custom solutions.