SUNNYVALE, Calif., 25 July 2009. LOGIC Devices, a developer of high-performance, low-power integrated circuits, has announced its latest family of multi-chip integrated devices.

This new product family facilitates the integration of LOGIC Devices' silicon IP as well as silicon IP from other semiconductor manufacturers, providing high-density packaged product solutions from memory arrays, subsystems, up to and including integrated systems in packages.

LOGIC Devices first iMOD products in development include a DDR3 wide-word device, a grouping of DDR1 wide-word modules, and a grouping of DDR2 wide-word devices.

This family of DDR1 integrated products supports data-transfer performance benchmarks of 200Mbps, 266Mbps, and 333Mbps at Industrial (-40C to +85C), Extended (-40C to +105C), and Military temperature (-55C to +125C).

The DDR1 family of integrated solutions provides the user with 53 percent space savings while reducing the parent board routing requirement by 34 percent when compared with the monolithic solution based on use of (5) TSOPII-66 pin packages.

An integrated DDR3, x64bit data-path memory device supporting DDR3-1333 at Industrial temperature, DDR3-1066 at Extended temperature, and DDR3-800 at Military temperature, supporting CL10-10-10, CL8-8-8, and CL6-6-6, respectively, while packaged in a 16mmx22mm, 271 ball-1.00mm pitch footprint.