CAMARILLO, Calif., 19 Aug. 2009. Interconnect Systems Inc. (ISI) in Camarillo, Calif., is offering a process of removing lead free solder spheres then attaching tin-lead (Sn63Pb37) eutectic lead solder spheres that has been qualified by commercial, industrial, military, and aerospace companies, ISI officials say.
This solder reballing process is in response to a wave of lead free parts that resulted from the European Restriction of Hazardous Substances (RoHS) directives that prohibited lead in solder. Many military applications still need lead solder electronics, cannot use RoHS compliant lead free packaging, and need a process to convert RoHS parts to lead solder parts.
ISI has developed a reballing process certifying that the silicon is protected to specific parameters. ISI certifies that:
1) the parts are protected through the process to IPC/JEDEC J-STD MSL Classification as required by the semiconductor supplier;
2) the process used for ball removal will protect the silicon, never subjecting it to a time temperature cycle above 50 percent of the supplier's recommended cycle;
3) the ball attach process will be in a nitrogen environment in a conduction convection oven and will never exceed 90 percent of the time temperature recommended by the supplier; and
4) the parts have been 100 percent optically inspected to ensure the device meets the original suppliers specifications for flatness and coplanarity.
Specific control parameters for each phase of handling, production and controls for temperature, humidity, ESD protection, ball size/position tolerance specifications, automation, cleanliness, 100 percent optical inspection and repackaging are maintained.
For more information contact ISI online at www.isipkg.com.
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