Sponsor


Microelectronics thermal management device from Nextreme meets MIL STD 883 shock standard

October 14, 2009

DURHAM, N.C., 14 Oct. 2009. An advanced heat-pumping thermoelectric device for electronics thermal management from Nextreme Thermal Solutions in Durham, N.C., has passed the 3000-G shock test as defined in the MIL STD 883E method 2002 mechanical shock standard, Nextreme officials say.

The Nextreme OptoCooler HV14 module can create a maximum temperature differential of as much as 60 degrees Celsius between its hot and cold sides with a zero heat load. The OptoCooler is suitable for cooling electronic and electro-optical devices such as laser diodes, avalanche photodiodes, and bright LEDs.

The OptoCooler HV14 is designed to operate at standard electrical power requirements. At 85 C the electronics cooling device operates at a maximum voltage of 2.7 volts and can pump 1.5 Watts of heat in a footprint of 3 square millimeters.

MIL-STD 883E is a guide for screening microelectronic devices for aerospace and electronic applications. The shock test helps determine if devices can withstand severe shocks from physical blows or abrupt changes in motion.

"The use of thin films in conjunction with our semiconductor-based assembly process reduces the mass of our devices substantively," says Dave Koester, vice president of engineering at Nextreme. "Our thermoelectric coolers and power generation devices are inherently more resistant to shock and vibration than standard bulk devices while at the same time providing performance advantages."

For more information contact Nextreme online at www.nextreme.com/optocooler.

Subscribe

-- Posted by John Keller, jkeller@pennwell.com. www.milaero.com.

Follow me on Twitter

Social Media Tools

Sponsored by:
Recommend this Article Recommend this Article () You Recommended this Article You Recommended this Article ()

REPRINTS: Is your company featured in this article? Click here to purchase reprints.


Most Popular Articles

Webcasts

On Demand

DO-178C: The Evolution of Software Technology in Safety

This webinar will examine the impact these supplements will have on certifiable aircraft software development, the developers and the processes which are used.

Sponsored by:

Small Form Factor

Join Military & Aerospace Electronics for an insightful Webcast on small form factor systems and components, including the benefits that SFF innovations hold for current and future mil-aero applications....

VPX for Unmanned Systems

Join us for this webcast as we hear from VITA and industry experts on the latest developments in VPX technology.

Mil & Aero Magazine

February 2012
Volume 23, Issue 2

M&AE Article Archives

Close this offer Close
Military & Aerospace Electronics Defense Executive Ebedded Computing Report Avionics Intelligence
Subscribe
FREE Newsletters from the Aerospace & Defense Media Group
Required field
Required field
Required field
I would like to receive the following e-mail newsletters
Military & Aerospace Electronics Weekly Yes No Required field
Defense Executive Yes No Required field
Embedded Computing Report Yes No Required field
Avionics Intelligence Yes No Required field
In order to subscribe, you must select at least one newsletter above.
No Thanks. No Thanks