SALEM, N.H., 13 Feb. 2010. Harwin broadened its range of surface mount EMI/RFI shield clips for defense and aerospace applications with the launch of its Maxi Clip, which handles protective cans with wall thicknesses of between 0.028 and 0.04 inches.
The use of clips reduces assembly time and simplifies rework. Rather than hand-soldering shielding cans to a printed circuit board (PCB) as a secondary operation, cans are simply be pressed into clips which have been placed during the main automated surface mount assembly processing. Not only does this save time, it also reduces errors and scrap, and enables sensitive components to be inspected and, if necessary, lifted, and replaced much more easily, Harwin officials say.
Harwin's EMI/RFI clips have protected sensitive ICs used in diverse applications such as the United Kingdom's Bowman military radio project and automotive SatNav and DVD players.
The new Maxi clips compliment Harwin's Midi clips which handle cans with a wall thickness of 0.012 inches and its Mini series devices which save PCB space and handle cans with a wall thickness of between 0.005 and 0.009 inches.
"To demonstrate the simplicity of these new clips, we have produced a short animation which shows how they enable users to realize savings during both initial production and rework," says Dave Humpreys, product manager at Harwin.
To view the animation, please go to: http://www.harwin.com/aboutus/videos/RFIshieldclips/index.html.
