All Access


3U VPX rugged enclosure for UAVs and other mission-critical airborne applications introduced by Dawn VME

FREMONT, Calif., 22 Sept. 2010. Dawn VME Products in Fremont, Calif., is introducing a ruggedized four-slot conduction-cooled rugged enclosure for 3U VPX modules called the CCE-3VX4 VPX Cube for unmanned aerial vehicle (UAV), land, sea, and airborne mission-critical conditions. Dawn's CCE-3VX4 VPX Cube is designed to MIL-STD-810F, DO-160E, and MIL-STD-461E standards, and complies with VITA 46 (VPX), VITA 48 (REDI) and VITA 65 (OpenVPX) specifications.

The VPX Cube features four slots of 3U VPX on a 1-inch pitch high bandwidth backplane and an integrated, wide temperature range 400 Watt power supply. The chassis is cold plate base coupled conduction cooled, and operates in temperatures from -40 to 85 degrees Celsius.

The backplane is Fabric Mapping Module (FMM) overlay ready. Front I/O mapping overlay enables signal path customization from card I/O, such as PMC and XMC, to front panel I/O interface connectors. The I/O panel to backplane is interfaced via shielded differential connectors for applications from 3.125 to 10 gigabytes per second.

Dawn's RuSHTM system health monitor technology for intelligent, precision monitoring and control of critical system performance parameters is embedded in the integrated power supply in the standard VPX Cube configuration.

For more information contact Dawn VME online at www.dawnvme.com.

Font Sizes:

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account.


Aerospace & Defense Trivia Challenge

How well do you know your aerospace history? In this month's M&AE trivia challenge you can find out - and then pit your knowledge against friends and colleagues!

Take the quiz and you'll be entered in a drawing for a $25 Visa gift card, courtesy of this month's sponsor, Sparton.

Here's a sampling of the questions you'll need to answer:

Up for the challenge? TAKE THE QUIZ!

Most Popular Articles

Webcasts

Upcoming

Thermal Design in Military Embedded Computing Applications

This webcast sponsored by Advanced Cooling Technologies will investigate and improve the thermal path from source to sink with the goal of minimizing the temperature rise in your electronics.

( 06/06/2013 / 02:00 PM Eastern Daylight Time / 01:00 PM Central Daylight Time / 11:00 AM Pacific Daylight Time / 18:00 GMT )

On Demand

The DNA Marking Controversy

John Keller, chief editor of Military & Aerospace Electronics, brings his 30-plus years of experience covering the aerospace and defense industry to this interactive webcast.

Mil & Aero Magazine

May 2013
Volume 24, Issue 5
file

Download Our Free Apps



iPhone

iPad

Android

Follow Us On...



M&AE Article Archives

Click here for past articles