All Access


Omnetics introduces space-saving hybrid Micro/Nano Connector for aerospace, defense applications

Omnetics Posted by Courtney E. Howard

MINNEAPOLIS, 6 Aug. 2011. Omnetics Connector Corp., a manufacturer of miniature high-reliability (hi-rel) connectors, has unveiled a hybrid Micro/Nano Connector designed to reduce weight and space, while also meeting design requirements. The new product combines either a standard nano (.64-mm pitch) or a standard micro (1.27-mm pitch) insulators and contacts in a CNC-machined metal shell, enabling engineers to combine power and signal processing in a compact area. 

The nano contacts can carry up to 1 amp per contact, while the micro contacts can handle 3 amps. The same nano and micro pins and sockets are used in the company’s QPL-qualified MIL-DTL-32139 and MIL-DTL-83513 connectors.

“Omnetics is constantly being asked for creative ways to reduce size and weight,” admits Greg Jones, North American sales manager. “By combining two connectors into one metal shell, we manage to accomplish our goal. Omnetics’ engineering works closely with design engineers to create unique solutions, whether it is combining connectors or designing a cable harness. Utilizing 3D modeling, design time is significantly reduced and the end product is one the design engineer can trust to be correct.”

 

Font Sizes:

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account.


Aerospace & Defense Trivia Challenge

How well do you know your aerospace history? In this month's M&AE trivia challenge you can find out - and then pit your knowledge against friends and colleagues!

Take the quiz and you'll be entered in a drawing for a $25 Visa gift card, courtesy of this month's sponsor, Sparton.

Here's a sampling of the questions you'll need to answer:

Up for the challenge? TAKE THE QUIZ!

Most Popular Articles

Wire News provided by   

Webcasts

Upcoming

Thermal Design in Military Embedded Computing Applications

This webcast sponsored by Advanced Cooling Technologies will investigate and improve the thermal path from source to sink with the goal of minimizing the temperature rise in your electronics.

( 06/06/2013 / 02:00 PM Eastern Daylight Time / 01:00 PM Central Daylight Time / 11:00 AM Pacific Daylight Time / 18:00 GMT )

On Demand

The DNA Marking Controversy

John Keller, chief editor of Military & Aerospace Electronics, brings his 30-plus years of experience covering the aerospace and defense industry to this interactive webcast.

Protect Your Embedded Systems: The Key to Platform Security

Join Wind River’s AJ Shipley, Senior Security Architect as he unveils the key to platform security, discussing how embedded device security requirements should be addressed with multiple levels of hardware a...
Sponsored by:

Mil & Aero Magazine

May 2013
Volume 24, Issue 5
file

Download Our Free Apps



iPhone

iPad

Android

Follow Us On...



M&AE Article Archives

Click here for past articles