NEWBURYPORT, Mass., 18 Dec. 2011. Rochester Electronics LLC in Newburyport, Mass., and the BAE Systems Support Solutions segment in Rockville, Md., are joining hands to make available more than 250,000 mature and end-of-life semiconductors for military and aerospace applications concerned with obsolescence management.
Developed from Rochester's wafer and die bank inventory, the re-created semiconductor devices are manufactured with the authorization of the original semiconductor manufacturer, and are form, fit and functional replacements that match the original semiconductor's performance exactly, Rochester officials say.
The BAE Systems Support Solutions Obsolescence Management Services group provides the Advanced Component Obsolescence Management (AVCOM) product and obsolescence management services. The Rochester/BAE Systems alliance has a staff of component and software engineers who translate Rochester wafer and die products to finished goods manufacturing part numbers.
This system helps Rochester to match material on hand to order requests. A custom module identifies replacement parts, which could save Rochester and BAE Systems customers millions of dollars in electronic system re-designs, Rochester officials say.
For more information contact Rochester Electronics online at www.rocelec.com, or BAE Systems Obsolescence Management Services at www.baesystems.com/ProductsServices/bae_prod_obsolescence_mgmt.
The third dimension in obsolescence management
Microsemi helps alleviate board obsolescence with multichip memory for TI Sitara, OMAP, and DaVinci processors
Obsolescence in avionics, the headache that doesn't go away.