Ceramic packaging introduced for Microsemi rad-tolerant FPGAs for space applications

MOUNTAIN VIEW, Calif., 10 Feb. 2012. The Microsemi Corp. SoC Products Group in Mountain View, Calif., is introducing ceramic quad flat pack (CQFP) packaging for the company's radiation-tolerant RT ProASIC 3 family of field programmable gate arrays (FPGAs), which are designed for applications involving orbiting satellites, manned spacecraft, and aircraft that operate at high altitudes for prolonged periods.

CQFP packages not only help the radiation-tolerant FPGAs withstand the effects of radiation levels that occur in space and at high altitudes, but it also helps space electronics withstand extreme operating temperatures.

Microsemi's RT ProASIC3 rad-hard FPGAs provide space-flight hardware designers a radiation-tolerant, reprogrammable, non-volatile logic integration integrated circuit for embedded computing applications involving spacecraft and aircraft.

The devices, which particularly are suited to low-power space applications, operate at 350 MHz and feature as many as 3 million system gates. The devices operate at a core voltage between 1.2 and 1.5 volts, depending on the application.

The RT ProASIC3 FPGAs are based on secure flash technology that is immune to radiation-induced configuration upsets, while eliminating the need for additional code storage, Microsemi officials say.

RT ProASIC3 FPGAs in ceramic packaging will be available for prototyping in April 2012 with flight units available by June 2012. For more information contact Microsemi SoC Products online at www.microsemi.com/soc.


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