Telcordia to provide Army with mobile vetronics communications and computing environment

WARREN, Mich., 8 April 2012. U.S. Army vetronics researchers are working with engineers at Telcordia Technologies Inc. in Piscataway, N.J., to develop an affordable communications and computing environment for Army vehicles under terms of an upcoming contract from the Army Contracting Command. Telcordia specializes in mobile, broadband, and enterprise software.

Army officials announced their intention last week to award Telcordia Technologies a sole-source contract for the Mobile Computing Application Platform (MCAP) Phase V. The contract, which has yet to be negotiated, will be awarded on behalf of the Army Tank Automotive Research, Development and Engineering Center (TARDEC) in Warren, Mich.

Army researchers are asking Telcordia Technologies to provide a sustainable, mobile, vehicle-centric, low cost, integrated, distributed communications and computing environment by linking together commercial off-the-shelf (COTS) products to reduce vetronics development, acquisition, and sustainment costs.

The upcoming contract calls for Telcordia Technologies to provide as many as 7,500 man-hours of engineering services over 12 months to build, test, demonstrate, and install MCAP Phase V software and equipment. MCAP is for the National Guard and emergency responders carrying out homeland defense and civil support missions.

For questions or concerns about this sole-source contract, phone Army contract specialist Michael Ivkov at 586-282-9754, or contracting officer Pamela Grozdon at 586-282-9751. More information is online at

For additional information contact Army TARDEC online at, or Army Contracting Command at

Follow Military & Aerospace Electronics and Avionics Intelligence news updates on Twitter

Military & Aerospace Photos

Most Popular Articles

Wire News provided by   

Press Releases

Low Viscosity, One Part Cyanoacrylate Is Non-Toxic and Meets ISO 10993-5 Specifications

Master Bond MB250NT is widely used for a variety of applications ranging from repair to high speed producti...

Thermally Conductive, Two Component Epoxy Passes USP Class VI Tests and ISO 10993-5 Specifications

With biocompatibility and cytotoxicity certifications, Master Bond EP21AOLV-2Med is often selected for bond...

One Component, Snap Cure Epoxy Features High Strength Properties

Suitable for a variety of applications in the electronic, aerospace and OEM industries, Master Bond EP3SP5F...

One Part Epoxy Resists up to 500°F and Meets NASA Low Outgassing Specifications

Master Bond Supreme 12AOHT-LO is a one component epoxy for a variety of bonding and sealing applications in...

VICTORY Shared Processing, Fire Control Computer, and Switch for Ground Vehicles Introduced by Curtiss-Wright

Curtiss-Wright Corporation today announced that its Defense Solutions division has introduced a new fully i...


Curtiss-Wright Corporation’s Defense Solutions division applauds Northrop Grumman Corporation (NYSE: NOC) o...

Curtiss-Wright’s New Rugged Mobile IP Router Subsystem Features an Integrated Cisco® 5915 ESR Router

Curtiss-Wright Corporation today announced that its Defense Solutions division, a Cisco® Systems Solution T...

GE Announces First Sub-Credit Card-Sized Multi-Function High Definition (HD) Video Tracker

HUNTSVILLE, AL.— OCTOBER 13, 2014—GE’s Intelligent Platforms business today announced at AUSA (October 13-...


Meeting the Gen3 backplane challenge with OpenVPX and COTS

Tight Pentagon budgets mean military systems must stay in the field for longer than ever before. This doesn't mean obsolete technology, however. Today's military electronics are being upgraded constantly, an...
Sponsored by:

Design Strategy Considerations for DO-178C Certified Multi-core Systems

Join Wind River to learn how system architecture and design choices can minimize your DO-178C certification challenges.

Sponsored by:

Flying, Sailing or Driving - The Rugged, Embedded Intel-based Server that goes where you need it!Flying Sailing or Driving

Leveraging the power of server-class processors is no longer relegated to the confines of data centers. Through several innovations, Mercury Systems has ruggedized Intel’s server-class chips for deployment. ...
Sponsored by:

All Access Sponsors

Mil & Aero Magazine

April 2015
Volume 26, Issue 4

Download Our Apps




Follow Us On...


Military & Aerospace Electronics

Weekly newsletter covering technical content, breaking news and product information

Cyber Security

Monthly newsletter covering cyber warfare, cyber security, information warfare, and information security technologies, products, contracts, and procurement opportunities

Defense Executive

Monthly newsletter covering business news and strategic insights for executive managers

Electronic Warfare

Quarterly newsletter covering technologies and applications in electronic warfare, cyber warfare, optical warfare, and spectrum warfare.

Embedded Computing Report

Monthly newsletter covering news on embedded computing in aerospace, defense and industrial-rugged applications

Unmanned Vehicles

Monthly newsletter covering news updates for designers of unmanned vehicles