X-ES announces support for third generation Intel Core i7 processor across product line

XPedite 7470

MIDDLETON, Wis. 25 April 2012. Extreme Engineering Solutions, Inc. (X-ES) is supporting  the third generation Intel Core i7 processor across eight industry-standard form factors - COM Express, 3U VPX, 6U VPX, 3U CompactPCI, 6U CompactPCI, VME, air-cooled PrPMC/XMC, and conduction-cooled PrPMC/XMC. The XPedite7470 3U VPX Single Board Computer (SBC) and XCalibur4401 6U CompactPCI SBC are the first X-ES products available to support the third generation Intel Core i7 processor.

Third generation Intel Core i7 processors provide higher performance and lower power compared to 2nd generation Intel Core i7 processors. 3rd generation Intel Core i7 processors also include Intel HD Graphics with DirectX 11, which supports OpenGL 3.1 and OpenCL 1.1. Initially, X-ES products are available with the quad-core Intel Core i7-3615QE, 2.3GHz and the quad-core Intel Core i7-3612QE, 2.1GHz.

Because of the lower power consumption of the 3rd generation Intel Core i7 processors, quad-core 3rd generation Intel Core i7 processors are more easily supported in conduction-cooled applications. As with all Intel processors used in X-ES designs, the 3rd generation Intel Core i7 processors are on Intel's embedded roadmap for at least 7 years of availability.

X-ES plans on supporting dual-core versions of 3rd generation Intel Core i7 processors when they become available as well.

For data sheets, visit the links below.

XPedite7470

XCalibur4401




Military & Aerospace Photos

Most Popular Articles

Wire News provided by   

Press Releases

One Part Epoxy Resists up to 500°F and Meets NASA Low Outgassing Specifications

Master Bond Supreme 12AOHT-LO is a one component epoxy for a variety of bonding and sealing applications in...

Low Viscosity, One Part Cyanoacrylate Is Non-Toxic and Meets ISO 10993-5 Specifications

Master Bond MB250NT is widely used for a variety of applications ranging from repair to high speed producti...

Thermally Conductive, Two Component Epoxy Passes USP Class VI Tests and ISO 10993-5 Specifications

With biocompatibility and cytotoxicity certifications, Master Bond EP21AOLV-2Med is often selected for bond...

One Component, Snap Cure Epoxy Features High Strength Properties

Suitable for a variety of applications in the electronic, aerospace and OEM industries, Master Bond EP3SP5F...

Curtiss-Wright’s New Rugged Mobile IP Router Subsystem Features an Integrated Cisco® 5915 ESR Router

Curtiss-Wright Corporation today announced that its Defense Solutions division, a Cisco® Systems Solution T...

VICTORY Shared Processing, Fire Control Computer, and Switch for Ground Vehicles Introduced by Curtiss-Wright

Curtiss-Wright Corporation today announced that its Defense Solutions division has introduced a new fully i...

CURTISS-WRIGHT CONGRATULATES NORTHROP GRUMMAN ON SUCCESSFUL FIRST FLIGHT OF SECOND MQ-4C TRITON UAS

Curtiss-Wright Corporation’s Defense Solutions division applauds Northrop Grumman Corporation (NYSE: NOC) o...

GE Announces First Sub-Credit Card-Sized Multi-Function High Definition (HD) Video Tracker

HUNTSVILLE, AL.— OCTOBER 13, 2014—GE’s Intelligent Platforms business today announced at AUSA (October 13-...

Webcasts

Meeting the Gen3 backplane challenge with OpenVPX and COTS

Tight Pentagon budgets mean military systems must stay in the field for longer than ever before. This doesn't mean obsolete technology, however. Today's military electronics are being upgraded constantly, an...
Sponsored by:

Design Strategy Considerations for DO-178C Certified Multi-core Systems

Join Wind River to learn how system architecture and design choices can minimize your DO-178C certification challenges.

Sponsored by:

Flying, Sailing or Driving - The Rugged, Embedded Intel-based Server that goes where you need it!Flying Sailing or Driving

Leveraging the power of server-class processors is no longer relegated to the confines of data centers. Through several innovations, Mercury Systems has ruggedized Intel’s server-class chips for deployment. ...
Sponsored by:

All Access Sponsors


Mil & Aero Magazine

April 2015
Volume 26, Issue 4
file

Download Our Apps



iPhone

iPad

Android

Follow Us On...



Newsletters

Military & Aerospace Electronics

Weekly newsletter covering technical content, breaking news and product information
SUBSCRIBE

Cyber Security

Monthly newsletter covering cyber warfare, cyber security, information warfare, and information security technologies, products, contracts, and procurement opportunities
SUBSCRIBE

Defense Executive

Monthly newsletter covering business news and strategic insights for executive managers
SUBSCRIBE

Electronic Warfare

Quarterly newsletter covering technologies and applications in electronic warfare, cyber warfare, optical warfare, and spectrum warfare.
SUBSCRIBE

Embedded Computing Report

Monthly newsletter covering news on embedded computing in aerospace, defense and industrial-rugged applications
SUBSCRIBE

Unmanned Vehicles

Monthly newsletter covering news updates for designers of unmanned vehicles
SUBSCRIBE