Curtiss-Wright Controls introduces the Cool-CC3 3U VPX conduction-cooled chassis

ASHBURN, Va. 12 June 2012. Curtiss-Wright Controls Defense Solutions (CWCDS), a business group of Curtiss-Wright Controls, has introduced the COOL-CC3, a new 6-slot high power chassis designed to help with the design of 3U OpenVPX systems. The newest member of CWCDS' Engineered Packaging group's Hybricon family of chassis, this forced air, conduction-cooled enclosure supports up to 6-slots of 3U 1" pitch payload OpenVPX conduction cooled cards and rear transition modules. Designed to satisfy extreme cooling requirements, such as those involved in aerospace applications or military embedded systems, the portable COOL-CC3 chassis meets ANSI/VITA 65 power and cooling requirements for conduction-cooled 75W 3U OpenVPX modules.

The Hybricon portable tower conduction-cooled enclosures are high performance development chassis with cooling for up to 150W per slot. These enclosures support 3U and 6U backplanes and are designed to the latest ANSI/VITA specifications.

The COOL-CC3 chassis is a vertical tower style chassis that supports 3U backplanes [OpenVPX (1" pitch), VPX, VPX-REDI] and provides OpenVPX compliant power and cooling. The enclosure has a carrying handle for portability, and an automatic fan speed control. The fans and cooling design provide a less than 55C chassis conduction rail temperature at 30C per ANSI/VITA 65 OpenVPX standard

The new COOL-CC3 (and its 6U variant, the COOL-CC6) complement CWCDS's air-cooled COOL-XC3 and COOL-XC6 development chassis, offering portable development chassis alternatives for higher power conduction-cooled module-based systems. The COOL-CC3 is designed to enable the integration and development of OpenVPX, VPX REDI and VPX systems and supports the latest ANSI/VITA 46.0, ANSI/VITA 46.10, ANSI/VITA 48.0, ANSI/VITA 48.2 and ANSI/ VITA 65 OpenVPX specifications.

Military & Aerospace Photos

Most Popular Articles

Wire News provided by   

Press Releases

Low Viscosity, One Part Cyanoacrylate Is Non-Toxic and Meets ISO 10993-5 Specifications

Master Bond MB250NT is widely used for a variety of applications ranging from repair to high speed producti...

Thermally Conductive, Two Component Epoxy Passes USP Class VI Tests and ISO 10993-5 Specifications

With biocompatibility and cytotoxicity certifications, Master Bond EP21AOLV-2Med is often selected for bond...

One Component, Snap Cure Epoxy Features High Strength Properties

Suitable for a variety of applications in the electronic, aerospace and OEM industries, Master Bond EP3SP5F...

One Part Epoxy Resists up to 500°F and Meets NASA Low Outgassing Specifications

Master Bond Supreme 12AOHT-LO is a one component epoxy for a variety of bonding and sealing applications in...

VICTORY Shared Processing, Fire Control Computer, and Switch for Ground Vehicles Introduced by Curtiss-Wright

Curtiss-Wright Corporation today announced that its Defense Solutions division has introduced a new fully i...


Curtiss-Wright Corporation’s Defense Solutions division applauds Northrop Grumman Corporation (NYSE: NOC) o...

Curtiss-Wright’s New Rugged Mobile IP Router Subsystem Features an Integrated Cisco® 5915 ESR Router

Curtiss-Wright Corporation today announced that its Defense Solutions division, a Cisco® Systems Solution T...

GE Announces First Sub-Credit Card-Sized Multi-Function High Definition (HD) Video Tracker

HUNTSVILLE, AL.— OCTOBER 13, 2014—GE’s Intelligent Platforms business today announced at AUSA (October 13-...


Meeting the Gen3 backplane challenge with OpenVPX and COTS

Tight Pentagon budgets mean military systems must stay in the field for longer than ever before. This doesn't mean obsolete technology, however. Today's military electronics are being upgraded constantly, an...
Sponsored by:

Design Strategy Considerations for DO-178C Certified Multi-core Systems

Join Wind River to learn how system architecture and design choices can minimize your DO-178C certification challenges.

Sponsored by:

Flying, Sailing or Driving - The Rugged, Embedded Intel-based Server that goes where you need it!Flying Sailing or Driving

Leveraging the power of server-class processors is no longer relegated to the confines of data centers. Through several innovations, Mercury Systems has ruggedized Intel’s server-class chips for deployment. ...
Sponsored by:

All Access Sponsors

Mil & Aero Magazine

April 2015
Volume 26, Issue 4

Download Our Apps




Follow Us On...


Military & Aerospace Electronics

Weekly newsletter covering technical content, breaking news and product information

Cyber Security

Monthly newsletter covering cyber warfare, cyber security, information warfare, and information security technologies, products, contracts, and procurement opportunities

Defense Executive

Monthly newsletter covering business news and strategic insights for executive managers

Electronic Warfare

Quarterly newsletter covering technologies and applications in electronic warfare, cyber warfare, optical warfare, and spectrum warfare.

Embedded Computing Report

Monthly newsletter covering news on embedded computing in aerospace, defense and industrial-rugged applications

Unmanned Vehicles

Monthly newsletter covering news updates for designers of unmanned vehicles