GE introduces rugged COM Express module for multi-display applications

CHARLOTTESVILLE, Va. 28 July 2012. GE Intelligent Platforms (NYSE: GE) has introduced the latest addition to the company's range of COM Express modules, the rugged bCOM6-L1400. Featuring the Intel Core i7 processor, the bCOM6-L1400 can support multiple independent displays in a variety of systems, such as military embedded systems, avionics, and a range of other embedded computing environments. As well as its graphics capabilities (VGA, LVDS with dual channel support and SDVO/TMDS/DisplayPort over DDI), the bCOM6-L1400 features up to 8GBytes of DDR3 memory, Gigabit Ethernet and four SATA interfaces, with support for both RAID 0 and RAID 1. Also provided for connectivity are eight USB 2.0 ports and four USB 3.0 ports. By separating the carrier card from the processor, the COM Express architecture extends the useful life of the subsystem by allowing upgrades of the processor alone. This reduces cost of ownership while helping the system's performance keep pace with changing needs.

The bCOM6-L1400 is offered with a choice of either a dual-core or quad-core processor and can be deployed in the harsh environments that are subject to extremes of temperature, vibration, shock and contaminants. Its components were selected for reliable operation in hostile environments, and the processor and memory are soldered to the board to improve resistance to external forces.

Extended mechanical construction protects the module, which is designed for optional conformal coating for greater resistance to moisture, dust, chemicals, and temperature extremes. Dynamic thermal management helps optimize uptime and prevent damage to the system.

GE is can provide customers with the support necessary to enable them to develop their own carrier card configurations, or to provide custom carrier card variants on request.

For a data sheet, visit GE here.