Syneren Technologies joins Transglobal Secure Collaboration Program

VIENNA, Va., 6 Aug. 2012. Syneren Technologies Corp., a provider of secure collaboration and information sharing solutions, has joined the Transglobal Secure Collaboration Program (TSCP), a government-industry consortium focused on secure collaboration for the defense community.

As a Silver Member of TSCP, Syneren Technologies will play a role in developing and deploying commercial off-the-shelf (COTS) solutions that enable widespread adoption of TSCP specifications. Syneren will support working groups, demonstrating proofs-of-concept, and pilot testing a one-stop intuitive solution for all "sensitive" file search and destroy solutions aligned to TSCP member needs.

Security threats to critical assets around the world are increasing at an accelerated pace and becoming ever more sophisticated, says a spokesperson. “This paradigm shift warrants a common, robust approach to ensure proper protection of information. TSCP's core mission is to identify and prioritize requirements for all aspects of secure collaboration and information-sharing, and then to develop frameworks for secure collaboration--from identity management, secure email, information labeling and handling to document sharing--for adoption by its member organizations and their supply chains.”

"We strongly believe that with all parties working together toward a common goal, we can reduce the risk of information security breaches, accelerate secure information sharing across Defense organizations, and reduce overall program costs," says Keith Ward, TSCP president and CEO.

"We now look forward to advancing the mission of the aerospace and defense sector and integrate our knowledge into TSCP specifications," says Dr. Amit Maitra, CTO of Syneren Technologies. "With all parties working together toward a common goal, we can greatly reduce the risk of information security breaches, facilitate and accelerate secure information sharing across A&D organizations and reduce overall program costs."

 


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August 2015
Volume 26, Issue 8
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