COM Express module for small-form-factor embedded computing introduced by AAEON

TAIPEI, Taiwan, 8 Jan. 2013. AAEON in Taipei, Taiwan, is introducing the NanoCOM-CV Rev.A COM Express Type 1 module for small-form-factor embedded computing designs in thermal-critical applications such as parking systems and home automation, or in compute-intensive applications for industrial automation, medical, and gaming.

A wide-temperature version for harsh environments is available on request.

The Com Express module has a low power BGA type Intel Atom N2600 1.6 GHz Dual Core processor. Complemented by the low-power Intel NM10 chipset, the NanoCOM-CV Rev.A module has wide temperature tolerance, company officials say.

The NanoCOM-CV Rev.A module measures 84 by 55 millimeters and packs 2 gigabytes of DDR3 memory onboard. Expansion interfaces include three PCI Express, one SMBus, and one LPC bus to connect to legacy I/O interfaces.

Eight USB 2.0 support, two SATA 3-gigabit-per-second interfaces with optional 4 gigabytes of SATA solid-state drive, one Gigabit Ethernet, one 18-bit single channel LVDS, and support of CRT/LCD simultaneous/dual view display, High Definition Audio and 8-bit programmable GPIO.

A matching MicroATX carrier board, the TF-ECB-916M-B11-01 is available for COM Express Type 1 modules on request. Software support includes Windows XP, Windows 7/8, and Linux Fedora.

For more information contact AAEON online at

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