SUFFOLK, Va., 25 Feb. 2015. Astute Electronics Inc. in Suffolk, Va., is introducing the AirBorn high-density, high-reliability HD4 interconnect technology for high-speed switch network fabrics and solid-state data storage applications.
HD4 was designed to be an electrically optimized and dense physical layer medium for the HyperTransport Technology Consortium's industry-standard HyperShare scalable interconnect technology. Claimed to be the smallest footprint in the industry, HD4 offers high bandwidth, minimized signal loss, and mission-critical reliability.
Although developed for the HyperShare platform, HD4 products also suits many other interconnect standards. The I/O link targets rack-in-cabinet-based systems that require higher bandwidth and density, providing as many as six I/O ports on a 7.4-millimeter pitch along a low-profile PCI Express.
The eight differential pair twinax cable construction enables four channels with 2.5 to 10 gigabits per second data rates per channel.
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The 1A contacts have four points of contact for performance and reliability, and devices can be mated and demated as many as 2500 times. An open-pin weld design allows for flexibility in termination schemes, and die-cast shells provide EMI shielding and simple termination.
For more information contact Astute Electronics online at www.astute.co.uk.
