Ceramics group releases 10-year IC packaging roadmap

by John Keller

The Ceramic Interconnect Initiative of the International Microelectronics and Packaging Society developed a 10-year ceramic industry roadmap that analyzes the current state of this industry, and forecasts future requirements in the use of ceramics in electronic packaging. Framers intend the roadmap to help guide investment in research, development, and deployment for the ceramic technology infrastructure. The document describes some of the benefits of using ceramic technology to package electronics and interconnect devices. To get a copy of the roadmap, contact the National Electronics Manufacturing Initiative on the World Wide Web at http://www.nemi.org, or the IPC at http://www.ipc.org/. —


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account.


The Innovation That Matters™ Quiz

Innovation is one of the key drivers in the Defense industry. View this short video of Leon Woo, VP of Engineering at Mercury Systems, on the role of innovation. Then, answer 3 simple questions correctly to be entered into a drawing to win an Eddie Bauer fleece jacket!

CONGRATULATIONS TO OUR TWO MOST RECENT WINNERS. "Nick from SPARWAR" and "Bridget from AOC."


Military & Aerospace Photos

Related Products

Electronic Warfare VPX Products

The VPX product line includes three products: Modular Quad IF Up and Down Converter, Modular Dire...

Interpoint™ MTR Series™ 50 Volt

The MTR Series™ MTR 50, 28 volt dc-dc converter offers up to 30 watts of output power from single...

Interpoint™ MFP Series™ Down-Leaded Point of Load

The new down-leaded version of its Interpoint™ MFP Series Point of Load (POL) converters are avai...

Related Companies

Crane Aerospace & Electronics

When failure is NOT an option...rely on Crane Aerospace & Electronics. We supply high-density, high-reliability c...

LEMO USA Inc

Provides a lightweight, compact aluminum connector. M-series connector is focused on the design that requires a MIL-3...

Positronic

Experience * Founded in 1966 * Involvement in the development of international connector specifications throug...
Wire News provided by   

Most Popular Articles

Webcasts

Digital signal processing for signals intelligence and electronic warfare

Military & Aerospace Electronics presents an expert Webcast on the latest hardware and software trends for high-performance embedded computing (HPEC) applications in demanding military signals intelligen...
Sponsored by:

Advantages of Intel Architecture Products and Wind River Solutions in Military & Aerospace Applications

This webinar explains the individual advantages of the Intel Architecture hardware, available for long-life supply, and the WRS software portfolio.  There are extraordinary advantages of combining such ...
Sponsored by:

Engineering the VPX high-speed data path for physical and signal integrity

Join Arrow Electronics and TE Connectivity, for an overview webinar of the standards, technologies and trends involving VITA and TE.

social activity

All Access Sponsors


Mil & Aero Magazine

February 2014
Volume 25, Issue 2
file

Download Our Apps



iPhone

iPad

Android

Follow Us On...



Newsletters

Military & Aerospace Electronics

Weekly newsletter covering technical content, breaking news and product information
SUBSCRIBE

Defense Executive

Monthly newsletter covering business news and strategic insights for executive managers
SUBSCRIBE

Embedded Computing Report

Monthly newsletter covering news on embedded computing in aerospace, defense and industrial-rugged applications
SUBSCRIBE

Unmanned Vehicles

Monthly newsletter covering news updates for designers of unmanned vehicles
SUBSCRIBE