Ceramics group releases 10-year IC packaging roadmap

by John Keller

The Ceramic Interconnect Initiative of the International Microelectronics and Packaging Society developed a 10-year ceramic industry roadmap that analyzes the current state of this industry, and forecasts future requirements in the use of ceramics in electronic packaging. Framers intend the roadmap to help guide investment in research, development, and deployment for the ceramic technology infrastructure. The document describes some of the benefits of using ceramic technology to package electronics and interconnect devices. To get a copy of the roadmap, contact the National Electronics Manufacturing Initiative on the World Wide Web at http://www.nemi.org, or the IPC at http://www.ipc.org/. —


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February 2014
Volume 25, Issue 2
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