Table of Contents

Military & Aerospace Electronics

05/01/2001
Volume 12, Issue 5
mae05
  • News

    • DDC to distribute aircraft databus test and simulation tools
      Leaders of Data Device Corp. (DDC) in Bohemia, N.Y., struck a deal with an Israeli test and measurement vendor May 1 to become the exclusive worldwide distributor of the dataMARS and dataSIMS databus analyzers.
    • RADARSAT-2 to use Space Electronics board for SAR
      Engineers at Astrium in Portsmouth, England are using single-board computers from Space Electronics for a synthetic aperture radar (SAR) system aboard the Canadian Space Agency satellite, RADARSAT-2.
    • Marine Corps UH-1 helicopters get new avionics systems
      A $74 million upgrade to communications and navigation systems aboard the U.S. Marine Corps UH-1N Huey helicopter fleet was completed in January on schedule and $2 million under budget, Navy officials say.
    • Raytheon readies COTS upgrade of U.S. submarine combat systems
      The networked combat systems aboard the U.S. Navy's fleet of nuclear-powered submarines is about to receive an infusion of commercial off-the-shelf (COTS) components as part of a planned upgrade of the Raytheon Combat Control System Mark 2 — better known as the CCS Mk 2.
    • F-22 avionics designers rely on obsolescent electronics, but plan for future upgrades
      The U.S. Air Force's new F-22 Raptor advanced tactical fighter is finally preparing to move into production after more than a decade of development.
    • Soldier's handheld radio to use Linux
      Engineers at ITT Aerospace Communications in Fort Wayne, Ind., and the Defense Advanced Research Projects Agency, or DARPA, in Washington, D.C., have decided to use a version of the popular open-source Linux operating system to run on the next generation handheld radio communications system for soldiers.
    • In Brief
      Peregrine Semiconductor to provide rad-hard capability for DMEA, L3 bolsters missile-defense capability with acquisition of Coleman Research, MORE...
    • The future role of chip-scale packaging in COTS reliability
      The relentless trend toward ever-shrinking components for electronic systems designs is driving development of new packaging technologies such as chip scale packages, better known as CSPs.
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