Chip-on-flex filter connector withstands thermal shock and vibration

The ITT Industries Electronic Components segment in Santa Ana, Calif., is offering the Cannon Chip on Flex (CoF) filter technology that reduces stress from thermal shock and vibration while protecting sensitive electronics in a lightweight package. In the MIL-DTL-38999 configurations, the CoF connectors have passed MIL-STD and MIL-DTL Series III testing for thermal shock, random vibration, humidity, and high altitude. The filter connectors are for high-reliability military, aerospace, and industrial applications, including integrated avionics, radio and navigation systems, fire-control devices, electronic countermeasures, satellite communications, and data transmitters. The Cannon CoF design replaces the internal and traditional ceramic planar-array block capacitor with a state-of-the-art flexible circuit where individual chip capacitors are surface mounted on a pad adjacent to the feed-through contact. Since the feed-through contacts are not soldered directly to the capacitor, thermal stress points that influence performance in thermal shock and vibration has been virtually eliminated. The result is a robust filter connector with superior mechanical performance and improved reliability. In addition, because the flex is lighter in weight, a connector weight reduction of as much as 15 percent is achieved for the MIL-DTL-38999 configurations. For more information contact ITT Cannon online at www.ittcannon.com.


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June 2015
Volume 26, Issue 6
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