Ceramics manufacturer CoorsTek in Grand Junction, Colo., is introducing the DuraStrate thick-film ceramic substrates for improved performance in thick-film substrates. CoorsTek is employing a grain of 1.5 to 2.0 micron microstructure material-chiefly responsible for a 20 percent increase in biaxial flexural strength over traditional materials. The DuraStrate material also offers improved thick-film performance, consistent thicknesses, improved camber flatness, and better aged adhesion. This enhanced durability should translate to improved process yields, longer product life, and superior reliability, company officials say. CoorsTek currently offers the DuraStrate ceramic for only the varieties of thick-film substrates that are 10 to 15 mils thick. “As the industry moves toward increased miniaturization, higher-power applications, and begins to demand longer-term reliability, they will need a more durable and reliable thick-film ceramic substrate,” says Lee Harder, vice president of CoorsTek. “We developed and fine-tuned the DuraStrate material specifically for these needs and expect to make a significant impact in the industry,” he continued. For more information, contact CoorsTek online at www.coorstek.com.