Sponsor


Thermal management a challenge for designers of future military aircraft

April 1, 2008

By Courtney E. Howard

SAN DIEGO—Thermal-management challenges in military and aerospace electronics systems today are “everywhere we look,” says Jim Robles of the Boeing Co. “Thermal management is quickly becoming a limiting design factor for future military aircraft and satellites.”

Robles made his comments in March during an address entitled “Aerospace Thermal Management Challenges and Solutions, A Boeing Perspective,” to the Military & Aerospace Electronics Forum (MAEF) conference and trade show in San Diego, sponsored by Military & Aerospace Electronics magazine.

Today’s aviation, vetronics, and other mil-aero applications require more power, but have less space—this contributes to higher thermal loads and less opportunity to drive the heat out, Robles describes.

Boeing customers care about the following, according to Robles: Total ownership cost, high functional density, reliability in harsh environments, compatibility with two-level maintenance, and the ability to facilitate insertion of new technology and mitigate component obsolescence.


Jim Robles of the Boeing Company, at right, participates in the Military & Aerospace Electronics Forum conference and trade show last month in San Diego. At left is Dr. Stephen Jarrett, chief technologist at the Space and Naval Warfare Systems Command.
Click here to enlarge image

Robles went on to discuss thermal-management options available to the mil-aero industry—such as conduction cooling and liquid flow-through cooling—as well as presented specifics about VITA circuit cards, ANSI/VITA documents, and other thermal-management information.

Interest in and use of directed-energy weapons and electric aircraft are growing, and these innovations require ultra-efficient energy systems. An industry need exists, Robles says, for “energy system technologies that provide dramatic improvements in capability and affordability.”

Some technologies that Boeing is investigating are lightweight carbon thermal-management systems, as well as fuel cells, CNT thermal interface, and spray cooling. “We are not going to have any other choice than to investigate and invest in spray cooling,” he predicts.

The aerospace thermal management challenge is driven by: more electric aircraft, directed energy weapons, and increased power and heat flux in avionics and vetronics. At the same time, mil-aero users in the future are always going to be interested in ramping it up–doing things faster, at greater distances, and so on.

“Future cooling demands will require an integrated thermal management strategy at the platform, subsystem, and component levels,” Robles says. “COTS in the future,” he proclaims. “That’s the way our lives are going to be.”

Social Media Tools

Sponsored by:
Recommend this Article Recommend this Article () You Recommended this Article You Recommended this Article ()

REPRINTS: Is your company featured in this article? Click here to purchase reprints.


Most Popular Articles

Webcasts

On Demand

DO-178C: The Evolution of Software Technology in Safety

This webinar will examine the impact these supplements will have on certifiable aircraft software development, the developers and the processes which are used.

Sponsored by:

Small Form Factor

Join Military & Aerospace Electronics for an insightful Webcast on small form factor systems and components, including the benefits that SFF innovations hold for current and future mil-aero applications....

VPX for Unmanned Systems

Join us for this webcast as we hear from VITA and industry experts on the latest developments in VPX technology.

Mil & Aero Magazine

February 2012
Volume 23, Issue 2

M&AE Article Archives

Close this offer Close
Military & Aerospace Electronics Defense Executive Ebedded Computing Report Avionics Intelligence
Subscribe
FREE Newsletters from the Aerospace & Defense Media Group
Required field
Required field
Required field
I would like to receive the following e-mail newsletters
Military & Aerospace Electronics Weekly Yes No Required field
Defense Executive Yes No Required field
Embedded Computing Report Yes No Required field
Avionics Intelligence Yes No Required field
In order to subscribe, you must select at least one newsletter above.
No Thanks. No Thanks