Sponsor


Leaders of e2v introduce low-noise interface for capacitive sensors

May 1, 2009

Leaders of e2v Technologies plc in Chelmsford, England, are introducing the CPIC2.0 high-resolution, low-power interface integrated circuit (IC) for capacitive sensors. Experts at e2v have made capacitive measurements, with 30aF resolution and a few micro amps current consumption, as easy as reading registers, company officials say. The company’s Mixed Signal ASIC (MSA) business unit specializes in solutions for sensor data acquisition in applications for safety and security, energy management and pollution reduction, and health and sports. The platform integrated circuits (ICs) from e2v are analog front-ends containing all the interface platforms (IPs) necessary to interface transducers. CPIC2.0 is part of e2v’s platform IC family, dedicated to very low-power, high-resolution measurement of capacitive sensing elements. CPIC2.0 can measure transducers with a base capacitance from 1 to 32 pF. It has a noise level of 30 aF (1aF = 10-18F), and contains a dual capacitor. For additional information, visit e2v online at www.e2v.com.

Social Media Tools

Sponsored by:
Recommend this Article Recommend this Article () You Recommended this Article You Recommended this Article ()

REPRINTS: Is your company featured in this article? Click here to purchase reprints.


Most Popular Articles

Webcasts

On Demand

DO-178C: The Evolution of Software Technology in Safety

This webinar will examine the impact these supplements will have on certifiable aircraft software development, the developers and the processes which are used.

Sponsored by:

Small Form Factor

Join Military & Aerospace Electronics for an insightful Webcast on small form factor systems and components, including the benefits that SFF innovations hold for current and future mil-aero applications....

VPX for Unmanned Systems

Join us for this webcast as we hear from VITA and industry experts on the latest developments in VPX technology.

Mil & Aero Magazine

February 2012
Volume 23, Issue 2

M&AE Article Archives

Close this offer Close
Military & Aerospace Electronics Defense Executive Ebedded Computing Report Avionics Intelligence
Subscribe
FREE Newsletters from the Aerospace & Defense Media Group
Required field
Required field
Required field
I would like to receive the following e-mail newsletters
Military & Aerospace Electronics Weekly Yes No Required field
Defense Executive Yes No Required field
Embedded Computing Report Yes No Required field
Avionics Intelligence Yes No Required field
In order to subscribe, you must select at least one newsletter above.
No Thanks. No Thanks