Parker Hannifin Corp. in New Haven, Ind., is introducing a two-phase liquid cooling system for electronic thermal management and heat removal from high-power electronics. Parker’s precision electronics cooling thermal management system technology, developed at Parker’s Climate Systems Division, can provide electronics cooling to power electronics designs of as much as twice the power density in half the space, Parker officials say. Using a vaporizable dielectric fluid for electronics liquid cooling, the system boils this fluid across the base of the silicon chip, converting the fluid into a gas, and stabilizing the system’s temperatures. “Because the liquid changes to a gas, we are able to remove two to four times more heat from the system,” explains Scott Gill, business unit manager for Parker’s Advanced Thermal Systems Business Unit. “Thermal management is one of the primary barriers limiting high-power electronics today. By using a dielectric (non-conductive) fluid, our system is safer than the traditional water-based approach and will never damage sensitive electronics.” For more information, visit Parker Hannifin online at www.powersystemscooling.com.