Themis introduces CoolShell high-performance rugged blade server

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Themis Computer in Fremont, Calif., is introducing CoolShell rugged server technology, which combines a high-performance, single-board computer and graphics processor in a blade server configuration for rugged systems applications in demanding environments. The CoolShell blade servers use commercial CPU boards in rugged packages that provide electronics cooling and thermal management. The system is stable and stiff, with air flow paths, heat exchangers, and impeller assembly combined in a one field-replaceable unit. Themis’ CoolShell embedded blade server technology combines network connectivity of as many as eight optical or copper ports and cabling, with front-panel access for all active components. Independent controller channels of copper and fiber Gigabit Ethernet controllers provide network and I/O security. The CoolShell CS-3U is a modular commercial blade server system that packs processing, memory, and I/O into 17.75-inch-deep 3U rack. All modules are replaceable from the front, and all cable connections are on the front panels. The CoolShell CS-3U, which fits in a standard 19-inch rack, includes five replaceable modules; a dual socket processor blade, an I/O module that accommodates as many as three double-high PCI Express controller cards, network interface controller module, and two power supply modules. Key CoolShell CS-3U features include one or two Intel Quad-Core Xeon 5440 series processors; as much as 64 gigabytes of memory; three dual-headed graphical processing units; SATA hard disk drive as large as 1 terabyte, with options for five additional 2.5-inch solid state drives; eight copper Gigabit Ethernet ports (RJ45); ability to withstand shock and vibration as strong as 25 Gs and 10 to 2,000 Hertz; meets MIL-STD-901D, 810, and 167; operating temperature as high as 50 degrees Celsius; resistance to dust, dirt, and electromagnetic interference; and Linux, Windows, and Solaris X86 operating system support. For more, visit Themis Computer online at www.themis.com.

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February 2014
Volume 25, Issue 2
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