THERMAL MANAGEMENT: CoolWall thermal management enclosure for 3U VPX and CompactPCI introduced by Curtiss-Wright

Curtiss-Wright Controls Electronic Systems in Littleton, Mass., is introducing CoolWall thermal management technology for rugged embeddd computing enclosures. It is more lightweight and offers improved payload power cooling when compared to traditional aluminum construction. This technology is based on a proprietary mixture of metal composite materials, and provides the ability to thermally manage high-power payloads in multiprocessing and digital signal processing (DSP) applications where size, weight, and power (SWaP) constraints are key design hurdles.

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CoolWall technology is available to embedded systems designers in a line of Hybricon-brand packaging-the first of which is a baseplate-cooled Hybricon SFF-6 enclosure for 3U-size electronic circuitboards. Similar enclosures for 6U cards are planned. The SFF-6 small-form-factor chassis dissipates as much as 400 watts of heat. This small ATR-style chassis is for 3U OpenVPX or CompactPCI embedded COTS subsystems designed for use in SWaP-constrained military environments. It supports cooling for 6-slot 3U OpenVPX (or 7-slot CompactPCI) 400-watt payload for rugged airborne and ground mobile applications, and is designed to OpenVPX, VPX, and VPX REDI draft specifications.


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February 2014
Volume 25, Issue 2

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