U.S. Navy leaders needed an electronics contract manufacturing specialist to build signal data processor-Sierra (SDP-S) systems for the Cooperative Engagement Capability (CEC) program, which blends radar information from several Navy systems to create a common air defense tactical display. They found their solution from Sechan Electronics Inc., Lititz, Pa.
Sechan won a $64.2 million contract from the U.S. Naval Sea Systems Command to manufacture (SDP-S) production units and engineering support services for the CEC program. The prime contractor for CEC is the Raytheon Co. Network Centric Systems segment in St. Petersburg, Fla.
The SDP-S includes the Sierra II cryptographic chip designed by the Harris Corp. RF Communications division in Rochester, N.Y., which helps the CEC meet cryptographic modernization requirements and use commercial off-the-shelf components to create an open-systems architecture. The SDP-S, which is the core of the CEC system, provides the processing power necessary to fuse the radar sensor tracks from several radar systems on the ground, in the air, and at sea. CEC distributes sensor and weapons data from existing systems by fusing tracking data from participating sensors and distributing it to all other participants using identical algorithms to create one common radar air defense tactical picture based on all sensor data available.
FOR MORE INFORMATION visit Sechan Electronics at www.sechan.com.