FREMONT, Calif. – Elma Electronic Inc. in Fremont, Calif., is introducing the CompacFrame family of embedded computing development chassis and enclosures that accommodates a 5-slot VITA 48.8 air flow-through (AFT) backplane for designing rugged aerospace and defense applications.
The CompacFrame development platforms assist in testing and application development, and facilitates air flow-through thermal management and electronics cooking for sensor payloads, electronic warfare (EW), target tracking and display, navigation systems, and threat detection.
The Type 39A unit is aligned to the Sensor Open Systems Architecture (SOSA) open-systems industry standard and accommodates 3U plug-in cards housed in 1.5-inch wide modules, according to VITA 48.8.
In place of the 5-slot AFT backplane at a 1.5-inch pitch, the CompacFrame can accept 1-slot VPX power and ground backplanes in a 1-, 1.2-, or 1.5-inch pitch.
The development chassis includes a VITA 46.11 chassis manager with Ethernet and serial ports accessible at the rear as well as voltage monitoring LEDS, test points, zeroize, NVMRO, reset, and power switches on the front panel.
The card cage of the VITA 48.8 AFT cooling platform provides a five-degree upward tilt for access to the 3U cards. A 1400-Watt ATX power supply comes standard and a convenient carrying handle provides for easy transport.
Jack screws are for insertion and extraction into a chassis, while VITA 48.8 eliminates card retainers and ejector/injector handles to reduce weight and enhance high-power dissipation of 3U and 6U modules.
For more information contact Elma online at www.elma.com.
