Method of heat removal is critical in design

Oct. 1, 2005
Recently, I read with great interest your article in the July 2005 issue of Military & Aerospace Electronics regarding the removal of heat from military electronic systems.

Recently, I read with great interest your article in the July 2005 issue of Military & Aerospace Electronics regarding the removal of heat from military electronic systems (“Is cooling the central design issue of our time,” p. 1). With over 21 years experience in military environmental control systems for a myriad of ground, air, and seaborne applications, I was pleasantly surprise to see that finally somebody “gets it.”

Far too often cooling is an afterthought in the design of the latest “black box” and by the time it is parameters such as power, volume, and weight are all at a premium.

Working in this arena is a new innovative company called International Mezzo Technologies located in Baton Rouge, La. Mezzo’s forté is the design and manufacture of microstructures for the removal of heat loads. Their Website is www.mezzotech.com.

Thank you again for an informative article and a great magazine.

Larry Taggart
President, Advanced Technology Solutions
Warrenton, Va.

Voice your opinion!

To join the conversation, and become an exclusive member of Military Aerospace, create an account today!