Overmolded electronics packaging available for licensing

Officials of Delphi Corp. in Troy, Mich., are offering their company’s advanced overmolding technology to encase electronics assemblies for licensing. Overmolding technology offers increased system reliability, manufacturing process advantages, and enhanced heat transfer capability while protecting the electronics from harsh environments, company officials say. Overmolding uses a transfer mold press and replaces underfilling processing equipment and other manual processing steps. Using this new process, Delphi typically observes a 100 percent improvement in heat transfer while reducing system-level packaging costs by 30 percent. The process also increases device interconnection reliability by as much 60 percent. For more information contact Delphi online at www.delphi.com.