Technology cools components during lead-free assembly

Cookson Electronics Assembly Materials in Jersey City, N.J., is offering ALPHA CoolCap technology to cool components and semiconductor packages during high-temperature lead-free rework and reflow. ALPHA CoolCap protects adjacent components during rework, while allowing electronic assemblers to maintain high yield and throughput, company officials say. ALPHA CoolCaps and CoolShields come in standard BGA and QFP rework kits. CoolCaps fit easily over most common BGA and QFP packages; CoolShields fit beside connectors and rows of small components. No adhesive is required and no residue is left on boards or components. “The higher temperatures required in lead-free electronics assembly rework and reflow create challenges to maintaining processing goals,” says Tom Hunsinger, product manager with Cookson Electronics. “ALPHA CoolCaps and CoolShields provide protection for components and semiconductor packages from these high rework and reflow temperatures that can very often cause defects such as opens/shorts, component warpage and popcorning.” For more information visit www.alphametals.com.