Packaging for rad-hard ASICs and FPGA-to-ASIC conversions

Aeroflex Inc. in Colorado Springs, Colo., is offering radiation-hardened packaging for application-specific integrated circuits (ASICs) for improved simultaneous switching output response, and is offering an external chip capacitor attachment option for the UT0.25 m m rad-hard ASICs and for FPGA-to-ASIC conversions. The chip capacitor attachment meets space quality levels. Aeroflex Colorado Springs offers the chip capacitor attachments to the company’s 208-flatpack package on any other Aeroflex-provided package options on new designs. For more information contact Aeroflex online at www.aeroflex.com/radhardASIC.