Heat sinks deliver high performance in low-airflow conditions

March 1, 2006
Advanced Thermal Solutions in Norwood, Mass., is offering maxiFLOW heat sinks for cooling ball grid arrays (BGAs) and other hot components in restricted air-flow conditions.

Advanced Thermal Solutions in Norwood, Mass., is offering maxiFLOW heat sinks for cooling ball grid arrays (BGAs) and other hot components in restricted air-flow conditions. MaxiFLOW heat sinks feature a low profile, spread-fin array that makes the most of surface area for effective convection cooling. The heat sinks are fabricated from extruded aluminum, which keeps thermal resistance to a minimum from the base to the fins, reduces weight, and reduces costs, company officials say. Tests on maxiFLOW heat sinks using an air flow rate of 100 linear feet per minute show that device junction temperatures can be reduced by more than 40 percent below the temperatures achieved using other heat sinks. For more information contact the company online at www.qats.com.

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