Heat sinks for low-airflow conditions

Advanced Thermal Solutions in Norwood, Mass., has introduced maxiFLOW heat sinks for cooling ball grid arrays and other hot components in the restricted air flow conditions typical of today’s condensed electronic packages. MaxiFLOW heat sinks feature a low-profile, spread-fin array that makes the most of surface area for air cooling. The heat sinks are of extruded aluminum, which keeps thermal resistance to a minimum from the base to the fins, reduces weight, and keeps costs low, company officials say. The expected life span of an electronic component is exponentially dependent on temperature. Higher-performance maxiFLOW heat sinks can help ensure reliable product life at a lower cost than custom designed solutions. MaxiFLOW heat sinks are available in lengths and widths ranging from 10 by 10 millimeters to 60 by 60 millimeters, and heights starting at 2 millimeters. For more information contact www.qats.com.