Growth in Asian chip manufacturing to continue at least for the next several years

March 1, 2008
Growth in semiconductor manufacturing capacity in Asia will increase at a compound annual growth rate (CAGR) of 10.8 percent in the five-year period from 2006 to 2011, predict analysts at In-Stat in Scottsdale, Ariz.

Growth in semiconductor manufacturing capacity in Asia will increase at a compound annual growth rate (CAGR) of 10.8 percent in the five-year period from 2006 to 2011, predict analysts at In-Stat in Scottsdale, Ariz.

“The pure-play foundries are becoming more important as outsourcing from Integrated Device Manufacturers (IDMs) is on the upswing,” says Mayank Jain, In-Stat analyst. “Pure-play foundries have maintained their lead in developing leading-edge process technologies. DRAM and Flash manufacturing capacity in the region is also witnessing substantial growth.”

During this growth period, Singapore will have the highest growth rate due to fresh investments from leading memory makers, In-Stat says. In 2006, Taiwan had the most 300-millimeter capacity, followed by South Korea.

In-Stat’s research is in the report “Semiconductor Manufacturing Capacity Trends in Asia” (#IN0703663ASM), which covers the semiconductor manufacturing capacity of Asia as a whole, and of individual countries, with a five-year forecast. It also provides an overview of 300-millimeter capacity in the region.

In addition, the report provides details such as capacity, process technologies, and wafer size for all the leading fabs in the region. For more information, visit In-Stat online at www.in-stat.com.

Voice your opinion!

To join the conversation, and become an exclusive member of Military Aerospace, create an account today!