CSPI selects SprayCool cooling for deployments in harsh environments

May 1, 2009
Engineers at CSP Inc.’s MultiComputer Division, a supplier of rugged embedded clusters in San Diego, needed a thermal management system for their company’s FastCluster product line.

Engineers at CSP Inc.’s MultiComputer Division, a supplier of rugged embedded clusters in San Diego, needed a thermal management system for their company’s FastCluster product line. They found their solution at SprayCool in Liberty Lake, Wash.

CSPI and SprayCool officials have partnered to integrate CSPI’s 3000 Series computers into enclosures that employ SprayCool’s liquid cooling technology. The systems are for high-performance digital signal processing (DSP), signals intelligence (SIGINT), and command, control, communications, computers, intelligence, surveillance, and reconnaissance (C4ISR) applications in airborne, shipboard, and unmanned aerial vehicles (UAVs).

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“Today’s military applications challenge suppliers to deliver maximum processing density in a package that can operate reliably under harsh conditions,” says Alexander R. Lupinetti, chairman and CEO of CSP Inc. “Our partnership with SprayCool allows us to meet this challenge head on, delivering field-proven capabilities in a system that is lightweight, compact, and capable of unprecedented compute power per cubic foot.”

SprayCool’s two-phase liquid cooling technology uses a fine mist of non-corrosive, non-conductive liquid, sprayed in a thin layer, which evaporates and cools electronics. The process continuously cycles within a sealed, closed loop system. SprayCool sealed enclosures are capable of cooling in excess of 500 watts per slot in an unpressurized environment, isolate the electronics from dirty and corrosive environments, and enable cooler, higher-performance, and more durable electronic devices, according to a company representative.

For more information, visit SprayCool online at www.spraycool.com.

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