· One XMC mezzanine module slot
· 3/4-length
· Non-Intelligent carrier card
· PCIe x8 interface
Acromag’s APCe8775 carrier card interfaces an XMC mezzanine module to a PCI Express bus in a PC-based desktop computer system.
The APCe8775 is a PCIe bus adapter board that allows a PC (PCIe bus master) to control and communicate with the hosted XMC module. It simply acts as an adapter to route signals between the system’s PCIe bus and the XMC module connector.
The I/O signals are accessible via rear connectors and though the front mounting bracket. To simplify wiring, Acromag offers cables to connect the carrier’s rear I/O signals to other carrier cards in adjacent slots. Cables are also available to connect the carrier’s rear I/O to a front panel connector in an adjacent slot.
Select XMC modules from Acromag’s offering of high-performance FPGA and I/O solutions or use any third-party ANSI/VITA 42 compliant mezzanine modules.
Performance Specifications
XMC Compliance
XMC Module: Complies with ANSI/VITA 42.0-2008. Contact factory for VITA 61 or 88 compatibility.
I/O Interface
Serial Rear I/O (P2_A, P2_B) Connector: Samtec QSH-DP 0.50 mm Q Pairs® high speed ground plane socket strip, differential pair. These ports provide the ability to connect to left and right neighbor carrier cards using high speed serial protocols such as XAUI or Aurora. Supports up to five transmit and five receive high speed (5Gb/s) differential pairs or five LVDS pairs when used with Samtec QPairs® High Speed Twinax cables. Rear I/O (J1) Connector: MD68 (internal SCSI), male. 32 LVDS pairs routed from the XMC J14 connector.
PCI Express Interface
PCI Express interface: 8-lane edge connector. Uses matched length impedance controlled PCIe card edge connector to XMC connector. PCIe Gen 1-3 capable. PCIe Gen 3 support dependent on system variables. PCIe bus compliance: This device meets or exceeds all written PCI Express specifications per revision 1.1 dated March 28, 2005.
Environmental
Operating temperature: 0 to 70°C. Storage temperature: -55 to 125°C. Relative humidity: 5 to 95% non-condensing. Power: The carrier provides +3.3V, +12V and -12V power to the XMC module. The +12V power source is jumper-selectable from the PCIe bus +12V supply or the PCIe graphics power connector. The DC/DC converter generates a -12V supply from the +12V source. +3.3V (±10%): 0mA. +12V (±5%): 270mA, typical with fan operating. Currents specified are for the carrier board only. For the total current required from each supply, add the XMC module currents. MTBF: Contact the factory.
Physical
Dimensions: Length: 10.00 inches (252.0 mm). Height: 4.200 inches (106.68 mm). Width: Occupies one slot. Board thickness: 0.062 inches (1.59 mm). Connectors: J1: Board-to-board connection of J14 user signals. J2: Power source select jumper. J3: Auxiliary power connector (PCIe graphics). J4: JTAG I/O voltage select jumper. J14, J16 : XMC user signals (rear I/O). J15: XMC PCIe signals. P1: PCI Express V1.1 x8 lanes card edge. P2, P3: Board-to-board connection of J16 user signals. P4: Fan power. P5: JTAG (Xilinx programming adapter).
Approvals
CE marked, FCC Part 15, Class A
