ANNAPOLIS, Md., 12 Feb. 2012. Radio communications experts at ARINC Inc. in Annapolis, Md., are using supercomputers to help systems integrators design and analyze the performance of complex antennas. Complex Antenna Engineering and Analyses. The ARINC Advanced Systems Engineering and Integration Division has installed a Linux-based supercomputer to support engineering analyses for ARINC’s external customers. The company’s previous supercomputer also remains available.

ANNAPOLIS, Md., 12 Feb. 2012. Commercial aircraft operators may start using an air traffic management (ATM) communications technology called the FANS 1/A over HFDL (FOH), after officials of the U.S. Federal Aviation Administration (FAA) approved FOH as a viable means of Air Traffic Service (ATS) communications. This means commercial aircraft may start using the global High Frequency Data Link (HFDL) network to communicate with air traffic controllers.

SIMI VALLEY, Calif., 12 Feb. 2012. Innovative Integration in Simi Valley, Calif., is introducing the PEX6-COP field-programmable gate array (FPGA)-based half-length PCI Express desktop or server coprocessor card featuring the Xilinx Virtex-6 FPGA family for digital signal processing (DSP) applications such as radar, signals intelligence (SIGINT), or wireless communications.

ELLICOTT CITY, Md., Feb. 11, 2012. Lockheed Martin [NYSE: LMT] has been competitively awarded one of five Operations Support (OPS) Services Indefinite Delivery Indefinite Quantity (IDIQ) contracts from the U.S. General Services Administration (GSA) Federal Systems Integration and Management Center (FEDSIM) in support of the Department of Defense’s Joint Improvised Explosive Device Defeat Organization (JIEDDO).

MARLBOROUGH, Mass., Feb. 11, 2012. Raytheon Company (NYSE: RTN) has received a $67.4 million contract modification from U.S. Naval Sea Systems Command for design and engineering support for the Cooperative Engagement Capability sensor-netting system.

MIDDLETON, Wis., 10 Feb. 2012. Extreme Engineering Solutions Inc. (X-ES) is introducing the XPand4201 sub-half ATR forced-air-cooled embedded computing enclosure for conduction-cooled modules in military embedded systems and similar applications like command, control, communications, computers, intelligence, surveillance, and reconnaissance; avionics; helicopters; fixed-wing aircraft; and unmanned vehicles.

MELBOURNE, Fla., Feb. 10, 2012. Harris Corporation (NYSE:HRS) has been awarded a multi-year, $11 million follow-on order for Warhead Replacement Tactical Telemetry Modules (WRTTM) supporting the U.S. Air Force Advanced Medium-Range Air-to-Air Missile.

ARLINGTON, Va., 10 Feb. 2012. Military communications experts at the U.S. Defense Advanced Research Projects Agency (DARPA) in Arlington, Va., are asking for industry's help in providing pervasive, high-throughput military communications to deployed military units by using a mobile backbone that provides communications over long distances to military units on the move.

ANNISTON, Ala., Feb. 10, 2012. BAE Systems in partnership with the Anniston Army Depot (ANAD) are refurbishing 440 M113A2 armored personnel carriers for Iraq through a foreign military sales contract worth more than $31 million.

MCLEAN, Va., Feb. 10, 2012. Science Applications International Corporation (SAIC) (NYSE: SAI) was awarded a prime contract by the Office of the Assistant Secretary of Defense for Nuclear, Chemical, and Biological Defense Programs (OASD [NCB]) to provide professional, technical, analytical and executive-level administrative services in support of the OASD (NCB) and other components of the Department of Defense (DoD).

MOUNTAIN VIEW, Calif., 10 Feb. 2012. The Microsemi Corp. SoC Products Group in Mountain View, Calif., is introducing ceramic quad flat pack (CQFP) packaging for the company's radiation-tolerant RT ProASIC 3 family of field programmable gate arrays (FPGAs), which are designed for applications involving orbiting satellites, manned spacecraft, and aircraft that operate at high altitudes for prolonged periods.

PRODUCT INTELLIGENCE, 9 Feb. 2012. CompactPCI has been a staple of many military computers for more than fifteen years. The venerable computer bus interconnect was ratified in 1995, and is still used today in applications where size and cost matter more than moving huge volumes of data.

SIDNEY, N.Y., 9 Feb. 2012. Amphenol Aerospace, a provider of interconnect systems, has unveiled a series of rugged, micro-miniature connectors designed to maximize size, weight, and power (SWaP) in high-reliability, harsh environments, as well as to deliver power throughput and consistent coupling by incorporating more electrical connections in a compact form factor. The company’s new 2M Series are available in shell sizes from 5 to 23, weigh 72 percent less and is 52 percent smaller than standard MIL-DTL-38999 connectors, and are intermateable and intermountable with existing micro-miniature, high-density connectors typically used in aerospace and defense applications.

WOODLAND HILLS, Calif., Feb. 9, 2012. Northrop Grumman Corporation (NYSE:NOC) has been awarded a contract by the U.S. Naval Supply Systems Command (NAVSUP) to repair avionics equipment on the SH-60 Seahawk helicopter and the EA-6B Prowler jet.

ROCHESTER, NY, February 9, 2012. Harris Corporation (NYSE:HRS), an international communications and information technology company, has received a $26.4 million order from the Kingdom of Jordan for Falcon III and Falcon II radios.

ROLLING MEADOWS, Ill., Feb. 9, 2012. Northrop Grumman Corporation (NYSE:NOC), together with DRS Technologies, announced the delivery of the first Next Generation Automatic Test System (NGATS) to the U.S. Army.

Wake Forest, N.C., Feb. 9, 2012. Connector distributor BTC Electronic Components announced the Glenair Series 77 class of environmental shrink boots. This series is known as the "Full Nelson" range.

GUELPH, Ontario, 9 Feb. 2012. Connect Tech Inc. in Guelph, Ontario, are introducing the COM Express carrier board for PC/104-Plus and PC/104-Express proof of concept or production embedded computing applications. The carrier board measures 17 by 115 millimeters, and is compatible with COM Express type 2 basic or compact modules, and is suitable for military embedded systems.