Industry News Flash

Rackmount solid-state power amplifier for high PAR waveforms introduced by Aethercomm

Rackmount solid-state power amplifier for high PAR waveforms introduced by Aethercomm

CARLSBAD, Calif., 29 July 2014. Aethercomm Inc. in Carlsbad, Calif., is introducing the SSPA 0.030-0.512-110-RM linear rackmount solid-state power amplifier for legacy and new high PAR RF and microwave waveforms.

Isolated DC-DC converters for semiconductor drive circuits and hybrid power introduced by GE

Isolated DC-DC converters for semiconductor drive circuits and hybrid power introduced by GE

DALLAS, 28 July 2014. The GE Critical Power business in Dallas is introducing the SHHN000A3CL isolated DC-DC converters for insulated-gate bipolar transistors and other semiconductor device drive circuits, or in hybrid power architectures and industrial applications.

Rugged mobile IP router for military ground vehicles and aircraft introduced by Curtiss-Wright

Rugged mobile IP router for military ground vehicles and aircraft introduced by Curtiss-Wright

ASHBURN, Va., 25 July 2014. The Curtiss-Wright Corp. Defense Solutions division in Ashburn, Va., is introducing an enhanced Parvus DuraMAR 5915 rugged mobile IP router subsystem for network switching in deployed military and commercial aerospace embedded computing applications such as tactical ground vehicles, helicopters, and fixed wing aircraft.

Low-profile PCI Express FPGA board for SIGINT and security introduced by BittWare

Low-profile PCI Express FPGA board for SIGINT and security introduced by BittWare

CONCORD, N.H., 24 July 2014. BittWare Inc. in Concord, N.H., is introducing the A5-PCI Express-L (A5PL) low profile PCI Express embedded computing board based on Altera's Arria V AZ field-programmable gate array (FPGA) for signals intelligence (SIGINT), security, network processing, and broadcast applications.

Compact rugged connectors for COTS military and aerospace applications introduced by LEMO

Compact rugged connectors for COTS military and aerospace applications introduced by LEMO

ROHNERT PARK, Calif., 23 July 2014. LEMO USA, Inc. in Rohnert Park, Calif., is introducing the MM compact connectors for COTS military, security, and aerospace, as well as other harsh-environment applications.

Briefcase Receiver for military, aerospace, and government uses introduced by IMT

Briefcase Receiver for military, aerospace, and government uses introduced by IMT

MOUNT OLIVE, N.J., 22 July 2014. Integrated Microwave Technologies LLC (IMT) in Mount Olive, N.J., is introducing the Briefcase Receiver (BCRx) for military, aerospace, and government applications.

Multi-channel PXI-based test solution for complex carrier aggregation introduced by Agilent

Multi-channel PXI-based test solution for complex carrier aggregation introduced by Agilent

SANTA CLARA, Calif., 21 July 2014. Agilent Technologies Inc. in Santa Clara, Calif., is introducing the LTE/LTE-Advanced multi-channel PXI-based test solution to accelerate the setup of multi-channel test system configurations and enable engineers to gain deeper insight into complex carrier aggregation and spatial multiplexing MIMO designs.

Harwin doubles current rating of high-rel power connectors for aerospace applications

Harwin doubles current rating of high-rel power connectors for aerospace applications

PORTSMOUTH, England, 18 July 2014. Harwin Inc. in Portsmouth, England, is doubling the current rating of the power contacts available for use in its Datamate Mix-Tek mixed-technology connector series from 20 to 40 amps.

1200-Watt laser from a 300-micron fiber at 976 nanometers introduced by DILAS

1200-Watt laser from a 300-micron fiber at 976 nanometers introduced by DILAS

MAINZ, Germany, 17 July 2014. DILAS in Mainz, Germany, is introducing a 1200-Watt output power laser from a 300-micron fiber at 976 nanometers as part of the company's COMPACT-EVOLUTION product line for industrial laser applications.

Harwin doubles current rating of high-rel power connectors for aerospace applications

Hyperspectral VNIR sensor for small hand-launched UAVs introduced by Headwall Photonics

FITCHBURG, Mass., 16 July 2014. Headwall Photonics Inc. in Fitchburg, Mass., is introducing the Nano-Hyperspec sensor to provide small hand-launched commercial unmanned aerial vehicles (UAVs) with hyperspectral imaging capability.

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Mil & Aero Magazine

July 2014
Volume 25, Issue 7
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