Raytheon licenses Ziptronix 3D interconnect technology for focal plane image sensor devices
Nov 19, 2009
MORRISVILLE, N.C., 19 Nov. 2009. Electro-optical engineers at the Raytheon Co. Vision Systems segment in Goleta, Calif., needed 3D integrated circuits for their imaging systems. They found their solution in direct bond interconnect (DBI) technology from Ziptronix Inc. in Morrisville, N.C.
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Space connector for satellite electronics data buses introduced by ITT
Aug 30, 2009
SANTA ANA, Calif., 30 Aug. 2009. ITT Interconnect Solutions in Santa Ana, Calif., is introducing a Micro Bus Floating (MBF) space connector for data bus applications in satellite electronics.
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Mil spec military connector introduced by ITT for RF and signal contacts
Jul 21, 2009
SANTA ANA, Calif., 21 July 2009. ITT Interconnect Solutions in Santa Ana, Calif., is introducing the high reliability mil spec 38999 Series military connector for RF and signal contacts with EMI shielding and adherence to MIL-DTL-38999 series I, II and III standards.
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ITT develops RF switching coaxial connector for military radios
Jul 13, 2009
SANTA ANA, Calif., 13 July 2009. – ITT Interconnect Solutions developed an RF switching coaxial connector for antenna and printed circuit board performance verification for use in military radios, mobile phones, two-way radios, and wireless modems.
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ITT Interconnect Solutions offers sealed circular connectors for high-pressure operating conditions
Apr 1, 2009
ITT Interconnect Solutions in Santa Ana, Calif., is introducing its miniature circular connectors called the MIKQ IP68 series.
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ITT introduces 19-way DIN connector for harsh environments
Feb 1, 2009
ITT Interconnect Solutions in Santa Ana, Calif., is introducing the 19-way automotive product DIN (APD) circular connector that withstands harsh and wet-area environments in applications such as commercial vehicles and industrial automation.
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ITT's mixed signal connector provides high and low voltage signal solution in one package
Dec 23, 2008
SANTA ANA, Calif., 23 Dec. 2008. ITT Interconnect Solutions developed a mixed signal connector, providing a complete turnkey solution for carrying high and low voltage signals in the same interconnect package. Designated the Mixed Signal HV MDM Series, the connector is the newest addition to ITT's line of MDM Series micro high density connectors.
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ITT Interconnect introduces rugged electrical connectors for transportation applications
Dec 1, 2008
ITT Interconnect Solutions in Santa Ana, Calif., is introducing electronic connectors for transportation applications called the Trident series.
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ITT Interconnect introduces rugged electrical connectors for transportation applications
Sep 19, 2008
SANTA ANA, Calif., 19 Sept. 2008. ITT Interconnect Solutions in Santa Ana, Calif., is introducing electrical connectors for transportation applications called the Trident series for vehicles, railroad equipment, robotic systems, communications, test, and manufacturing equipment.
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ITT jam-resistant avionics connectors prove their worth at Red Flag exercises
Sep 3, 2008
SANTA ANA, Calif., 3 Sept. 2008. U.S. Air Force officials are recommending the field-replaceable connector system (FRCS) from the ITT Corp. Interconnect Solutions segment in Santa Ana, Calif., for use on MIL-STD-1760 weapons on F-16 Fighting Falcon jet fighter avionics.
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Teledyne to provide autonomous underwater vehicles
Jun 21, 2008
THOUSAND OAKS, Calif., 21 June 2008. Teledyne Technologies Inc.'s subsidiary, Teledyne Instruments Inc., has entered into an agreement to acquire assets of Webb Research Corp. Webb Research, in E. Falmouth, Mass., is a leading manufacturer of autonomous underwater gliding vehicles, as well as autonomous profiling drifters and floats. Terms of the transaction were not disclosed.
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ITT offers high-temp connectors able to meet railway fire safety standards
May 29, 2008
Connector product -- SANTA ANA, Calif., 29 May 2008. ITT Interconnect Solutions in Santa Ana, Calif., is introducing high-temperature circular connectors called the CIR Series that can withstand temperatures as hot as 800 degrees Celsius for at least 15 minutes. The connectors meet European CEN/TS 45545 standards governing railway fire safety.
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3D packaging technologies evolve in response to miniaturization
Apr 25, 2008
PALO ALTO, Calif., 25 April 2008. Three-dimensional (3D) packaging is expected to emerge as a dominant performing solution in the electronic/chip packaging industry, says a new study from Frost & Sullivan. The analysis finds that 3D packaging technology will be key in catering to the ever-increasing miniaturization demands from application sectors. The electronic/chip packaging industry has started exploring various forms of system in package-based solutions.
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ITT develops high-temperature micro connector for harsh environments
Apr 21, 2008
SANTA ANA, Calif., 21 April 2008. ITT Interconnect Solutions in Santa Ana, Calif., has developed high-temperature micro connectors for harsh operating conditions. The MDM Series connectors operate in temperatures as hot as 200 degrees Celsius and can be terminated in daisy-chain configurations within complex electronic instrumentation packages.
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Phil Angelotti takes over as TSI Group sales and marketing director
Apr 6, 2008
NORTH HAMPTON, N.H., 6 April 2008. TSI Group Inc. in North Hampton, N.H., is appointing Phil Angelotti as director of sales and marketing for the Braze West division, which comprises ADB Industries, CGR Technologies, and Thompson Industries.
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FCI develops connectors to enable MicroTCA architecture
Feb 1, 2008
FCI, a developer of connectors and interconnect systems in Etter, Pa., is offering backplane signal connectors and power module input connectors that comply with the MicroTCA specification issued by PICMG.
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ITT offers servomotor connector for applications with limited footprints
Dec 24, 2007
SANTA ANA, Calif., 24 Dec. 2007. ITT Interconnect Solutions in Santa Ana, Calif., is offering its Cm2 servomotor connectors with extended voltage range, which feature a voltage range from 48 to 630 volts AC.
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FCI develops connectors to enable MicroTCA architecture
Nov 6, 2007
ETTER, Pa., 6 Nov. 2007. FCI developer of connectors and interconnect systems in Etter, Pa., is offering backplane signal connectors and power module input connectors that comply with the MicroTCA specification issued by PICMG.
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Department of Defense contracts Endicott Interconnect Technologies to research, develop electronics packaging technologies
May 30, 2007
ENDICOTT, N.Y., 30 May 2007. The U.S. Department of Defense has awarded Endicott Interconnect Technologies Inc. a $49 million follow-on production contract that includes a $5 million contract for research and development of electronics packaging technologies, including printed circuit boards and substrates for the next generation of high-productivity computing.
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