Hey! It’s getting HOT in here!
As you look to leverage the latest in high-performance processors, you also are looking at significantly higher heat loads. There are several ways to manage these thermal loads but some add expense, others increase size and weight, and some cause maintenance headaches. As a result, board-level and chassis heat dissipation is a real challenge for the military embedded system designer.
This whitepaper examines several of the cooling techniques that people are implementing and highlights the pluses and minuses of each. It also lays out some new innovations that help you manage thermal loads at both the board and chassis level.
This White Paper brought to you by Mercury Systems.

Here’s the problem:
• The newest high-performance commercial processor has just come out
• In order to meet your customer’s requirements, you want to use it in your system
• Your software developers want to get started coding but it will take months for hardware designers to implement the new chip in an embedded computer board
• You can’t WAIT several months to get started
• How can you start working in parallel so your software team can create the code while the hardware is being designed?

This whitepaper explores a methodology for the rapid development of software for embedded systems. This methodology enables you to implement the latest generation of hardware, preserve the investment in legacy software, enable dispersed software teams to work together on a common system and significantly reduce development time.

This White Paper brought to you by Mercury Systems.