White Papers

Tackling the Thermal Design Challenges of Smaller, Lighter, and More Efficient Avionics

May 31, 2013

With every Kelvin increase in temperature, the risk of avionic component failure increases. For civil and military applications, the thermal characteristics of avionic components directly influence overall thermal management. They dictate the size, weight, and power (SWaP) of the cooling and therefore the overall system and can decide between function and failure. Commercial off-the-shelf components for avionic systems may cost less, but the lower price has to be weighed against SWaP and reliability to ensure the whole cooling system is viable.
This article demonstrates how thermal transient testing combined with computational fluid dynamics (CFD) can help find this balance and ensure that safety critical devices work within their prescribed temperature limits. Some industry examples illustrate how this process is helping companies create higher quality products and develop faster, more efficient, and cost-effective avionics systems.

This White Paper brought to you by Mentor Graphics.

COTS Continuum for Defense Systems

May 31, 2013

Today’s Defense & Aerospace deployed system development is driven by the DoD’s Defense Acquisition Management System as detailed in DoD Instruction DoDI 5000.02. Government Program Managers (PM) and their Prime System Integrator counterparts follow the well-defined steps overseen by the Office of the Secretary of Defense, with requirements managed through the Joint Capability Integrated Development System (JCIDS) process. This formal approach calls out three major decision authority review stages, shown as milestones “A”, “B”, and “C” in the diagram below, that the DoD uses to progress a program through the development process.

This White Paper brought to you by Curtis-Wright Controls Ashburn.

Sponsored by:

Understanding HPEC Computing: The Ten Axioms

May 31, 2013

High Performance Embedded Computing (HPEC) is bringing previously unobtainable levels of processing power to compute-intensive defense and aerospace applications, through its unique convergence of high performance computing (HPC), embedded systems, and sensor systems. The requirements of HPEC systems, used to satisfy demanding signal, radar and image processing, comprise a distinct market in which select best-of-breed technology is adopted from large commercial markets and then modified for use in military environments.

This White Paper brought to you by Curtis-Wright Controls Ashburn.

Sponsored by:

Shock and Vibration Testing of the SA.45s Chip Scale Atomic Clock (CSAC)Validation Build Units

May 31, 2013

The Symmetricom® SA.45s Chip Scale Atomic Clock (CSAC) is designed for field applications where atomic clocks typically have not been deployed before. It is smaller, lighter and uses less power than any previous atomic clock and is engineered to withstand higher levels of shock and vibration. This paper summarizes a series of mechanical shock and vibration tests to confirm the CSAC’s hardware environmental performance.

This White Paper brought to you by Symmetricom.

Sponsored by:

The Importance of Designing Out Manufacturing Defects in Minimizing Field Failures

May 29, 2013

The cost associated with a field failure of a high value, mission critical product or subassembly typically far exceeds the actual unit cost, since it may disable a higher cost system or result in mission or project failure. Designing in reliability is the ultimate responsibility of the product’s original equipment manufacturer (OEM). However, if the product is outsourced, the contract manufacturer can make significant contributions to “designing out” issues that can drive manufacturing defects that lead to field failures. Additionally, a robust inspection and test strategy can further eliminate unseen defects that could otherwise drive field failures. Optimum Design Associates routinely sees these opportunities in its customer base. This paper looks at some of the most important considerations in minimizing defects likely to contribute to increased field failures.

This White Paper brought to you by Optimum Design Assoc.

Measuring Agile Signals and Dynamic Signal Environments

April 30, 2013

Learn how real-time spectrum analysis techniques can help make precise and selective measurements of complex and elusive signals. Then see how to take the vital next steps to complete the solution with post-processing analysis, signal replay, and transfer of captured signals to other analysis or simulation tools.

This White Paper brought to you by Agilent Technologies Inc.

Sponsored by:

Determination of Capacitor as a Function of Operating Voltage & Temperature Life

April 30, 2013

Potentiostatically charged Hybrid capacitors age predictably by a mechanism involving electrochemical reactions that reduce the efficiency of the cathode and consume electrolyte. One of these reactions results in the formation of hydrogen at the cathode which reacts irreversibly with the tantalum foil substrate. The material formed is much less conductive than the original. The consequence to capacitor performance is an increase in ESR and a decrease in capacitance. It has been assumed that the rate of this wear-out mechanism is directly related to the leakage current in the capacitor. This means that the relative age of a capacitor is proportional to the quantity of charge passed as leakage current. If one knows what quantity of charge a capacitor can pass over its useful life, capacitor life can be easily estimated by determining the leakage current under any proposed operating conditions.

This White Paper brought to you by Evans Capacitor Company.

Sponsored by:

Making Digital Audio Measurements on Devices that have Incompatible Logic Levels

April 30, 2013

Demands on faster, smaller and more energy efficient digital audio devices have driven the need for devices from operating at the traditional 5 V to core voltage levels of well below 1 V. These low voltages and the variety of different voltages in use between devices can result in interface compatibility problems as well as measurement issues. Read this application note and learn more about the potential issues that can arise when making digital audio measurements on devices that have incompatible logic levels. 

This White Paper brought to you by Agilent Technologies Inc.

Sponsored by:

High Performance Embedded Computing and Its Impact on Mil/Aero Applications

April 25, 2013

High Performance Embedded Computing (HPEC) combines the latest processor and interconnect technologies with infrastructures such as OpenVPX and standard software components to allow military programs to pack more computing power into smaller size, weight and power (SWaP) for SIGINT, radar, EW, and many other applications. The drive toward Modular Open Systems Architectures (MOSA) is at the heart of GE’s selection of technologies, and this paper examines how this can positively impact programs.

This White Paper brought to you by GE Intelligent Platforms.

Sponsored by:

Critical Techniques for High-Speed A/D Converters in Real Time Systems

April 22, 2013

Recently updated and expanded to its 8th edition, this handbook reviews the markets and technology for A/D converters with sampling rates higher than 100 MHz. It discusses sampling and filtering techniques and new FPGA technology for A/Ds. The latest Pentek high-speed A/D products and applications based on such products are also presented.

This White Paper brought to you by Pentek, Inc.

Sponsored by:

Putting FPGAs to Work in Software Radio Systems

April 22, 2013

Recently updated and expanded to its 7th edition, this handbook reviews the latest FPGA technology and how it can be put to use in software radio systems. FPGAs offer significant advantages for implementing software radio functions such as digital downconverters and upconverters. These advantages include design flexibility, higher precision processing, lower power, and lower cost. Pentek SDR products that utilize FPGA technology and their applications are also presented.

This White Paper brought to you by Pentek, Inc.

Sponsored by:

What They Didn't Teach You in Engineering School About Heat

March 20, 2013

Until recently, the commercial software available for CFD typically has been geared towards specialists, limiting its widespread use. Besides being expensive, these tools have either been difficult, cumbersome or time-consuming to use. As a result, engineering analysis for applications such as heat transfer traditionally have been carried out by specialists in analysis departments, separate from mainstream design and development departments.

Fortunately, new tools have emerged that embed a complete range of flow analyses including heat transfer simulation within mainstream MCAD toolsets.

This White Paper brought to you by Mentor Graphics.

GPUDirect™ RDMA

March 19, 2013

GPUDirect RDMA solves an age-old problem for GPUs by removing the CPU and system memory bottleneck. By doing so, GPUDirect RDMA greatly decreases the latency of streaming data into the GPU from external PCIe endpoints and increases bandwidth through more efficient PCIe intercommunication. This allows the GPU to move into new application domains, like electronic warfare and radar/SIGINT frontends, which were previously inaccessible due to low-latency requirements.

Learn how the latest generation of Kepler™-family GPUs and CUDA™ 5.0 from NVIDIA®, along with a new feature called GPUDirect™ RDMA enable 3rd-party PCIe endpoints to DMA directly to and from the GPU, without the use of system memory or the GPU.

This White Paper brought to you by GE Intelligent Platforms.

Sponsored by:

Weight Reduction and Space Savings in Wire and Cable Design and Their Contribution to Aerospace Design and Operational Efficiency

February 28, 2013

Like every other military and aerospace component, wire and cable is under increased scrutiny as engineers look for weight and space savings in their designs. This is particularly true given the increasing amounts of data and coaxial cable needed to support advanced electronic systems. This white paper discusses how material and design innovations are resulting in smaller, lighter-weight cables that meet exacting military and aerospace standards for electrical, mechanical and environmental performance, while also providing appreciable size and weight advantages over conventional cable designs.

This white paper brought to you by Thermax.

Sponsored by:

Data Cabling for Today’s and Tomorrow’s Aircraft Abstract

February 28, 2013

As more advanced avionics, CMS and IFE systems make their way into aircraft, the amount of 10 gigabit cable deployed to support current and future systems is increasing significantly. Unfortunately, the pathway space remains the same. Engineers in the aerospace industry therefore need cables that meet highly reliable 10 gigabit signal transmission performance, while also taking up less space, lowering the total cable weight and providing installable performance irrespective of the tight pathways of an aircraft. Thermax’s new white paper discusses optimum data cabling characteristics– including reliable 10 gigabit performance, compact size, installable performance and durability, and lower weight per foot – for meeting aircraft design challenges such as tight routing, harsher environments, and lighter, more fuel-efficient aircraft. This White Paper was sponsored by Thermax.

Sponsored by:

Concurrent Engineering

February 28, 2013

Here’s the problem:
• The newest high-performance commercial processor has just come out
• In order to meet your customer’s requirements, you want to use it in your system
• Your software developers want to get started coding but it will take months for hardware designers to implement the new chip in an embedded computer board
• You can’t WAIT several months to get started
• How can you start working in parallel so your software team can create the code while the hardware is being designed?

This whitepaper explores a methodology for the rapid development of software for embedded systems. This methodology enables you to implement the latest generation of hardware, preserve the investment in legacy software, enable dispersed software teams to work together on a common system and significantly reduce development time.

This White Paper brought to you by Mercury Systems.

Sponsored by:

Introduction to Hypervisor Technology - Part 1

February 26, 2013

Today, with the quad-core Intel® Core™ i7 and associated bridge, memory and hardware, it’s possible to design an SBC with multi-core processors and run multiple operating systems.

The key element that makes it possible to move from older  Asymmetrical Multiprocessor (AMP) designs to now fully leverage the potential of multi-core processors is Hypervisor.

This White Paper brought to you by Curtis-Wright.

Sponsored by:

CFD for Mechanical Design Engineers - "A Paradigm Shift for Better Design"

February 22, 2013

Computational Fluid Dynamics (CFD) analysis is no longer a discipline reserved only for highly trained practitioners. A new class of CFD analysis software known as “Concurrent CFD” is proving to be greatly effective at performing pressure drop analysis, enabling mechanical engineers to accelerate key decisions at their workstations, without the need for CFD specialists.

Sponsored by Mentor Graphics.

Innovations in Thermal Management

February 15, 2013

Hey! It’s getting HOT in here!
As you look to leverage the latest in high-performance processors, you also are looking at significantly higher heat loads. There are several ways to manage these thermal loads but some add expense, others increase size and weight, and some cause maintenance headaches. As a result, board-level and chassis heat dissipation is a real challenge for the military embedded system designer.
This whitepaper examines several of the cooling techniques that people are implementing and highlights the pluses and minuses of each. It also lays out some new innovations that help you manage thermal loads at both the board and chassis level.
This White Paper brought to you by Mercury Systems.

Sponsored by:

Avoid Hidden Contract Manufacturing Costs — Read our White Paper

February 8, 2013

In the electronics industry, contract manufacturing has long been a strategy for reducing time to market and simplifying project oversight. With today's complex production environment, you need to ensure the intricacies of your project are addressed — without adding extra cost. And that means doing your homework. In our white paper, "Contract Manufacturing Pitfalls: What the Wrong Production Process Could Really Cost You," we uncover eight hidden cost centers — and show you how to avoid them. Read our white paper now!

This White Paper brought to you by Sparton Corporation.

Sponsored by:

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Mil & Aero Magazine

April 2014
Volume 25, Issue 4
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