White Papers

Integrating Obsolescence with Program Goals

May 18, 2011
Diminishing Manufacturing Sources and Material Shortages (DMSMS) teams are consistently under pressure to be proactive in managing obsolescence.   The reality is that due to the lack of planning for obsolescence, most End of Life issues are dealt with in a very reactive way, costing the program both customer service and profit losses.  In this series we will reveal to the reader the Channel One Electronic Systems Obsolescence Management framework that can positively impact your program goals. 

Replace Real-Time Hardware with Multi-Core Software

May 18, 2011

 

By moving real-time control away from specialized hardware into multi-core software, developers can lower costs, raise quality, and increase differentiation. To access these opportunities, developers can use IntervalZero¹s RTX, a hard real-time symmetric multiprocessing (SMP) extension to Microsoft Windows.

Sponsored by:

Intel® Advanced Vector Extensions: Next-Generation Vector Processing

April 11, 2011

The new Intel® Advanced Vector Extensions (Intel® AVX) can double the peak floating-point performance of Intel® Streaming SIMD Extensions (Intel® SSE), opening up new possibilities for applications like radar detection, video analytics, and medical imaging. Download this informative article from the Spring 2011 Embedded Innovator newsletter to learn more.

Sponsored by:

No Room for Error: Creating Highly Reliable, High-Availability FPGA Designs

January 3, 2011

Designers of FPGAs for military and aerospace applications need to increase the reliability and availability of their designs. This is particularly true in the case of mission-critical and safety-critical electronic systems. This paper provides brief definitions of key concepts: mission-critical, safety-critical, high-reliability, and high-availability. It then considers the various elements associated with the creation of high-reliability and high-availability FPGA designs including: FPGA design and verification flows, methodologies, processes and standards, architectural and algorithmic exploration, geographically distributed design teams, IP selection and verification, DO-254 compliance and much more.

Author: Angela Sutton, Staff Product Marketing Manager, Synopsys

Sponsored by:

The Coolest Compounds

August 10, 2010

Through heat dissipation, thermally conductive adhesives and potting compounds play a pivotal role in the protection of today’s electronic circuitry.  In tandem with the great growth of the technological sector comes the need for a new generation of innovative, highly advanced solutions capable of reliable performance in the ever increasing temperatures of electronic devices. Master Bond’s white paper examines the challenges design engineers face as chip makers up the ante on microprocessor power and density, and how thermally conductive adhesives and potting compounds can manage heat while solving other application issues.

Sponsored by:

Understanding Low Outgassing Adhesives

June 21, 2010

Applications that must meet stringent outgassing requirements now have more adhesive options than ever. If you suspect outgassing could potentially pose a problem in your application, specifying adhesives that comply with the ASTM outgassing standard makes sense.

Engineers often want to know whether an adhesive is low outgassing or generic. And while there are cases when nothing but a low outgassing product will do, the truth is that many so-called generic adhesives inherently have low outgassing levels. What's more, most bonding, potting, encapsulation and sealing applications don't need to meet a defined outgassing specification. Here's a guide to understanding when low outgassing adhesives are the right choice.

Sponsored by:

The Aerospace Industry Takes a Fresh Look at Its Wire Harness Design Approach

June 2, 2010

The aerospace industry has long been perceived as slow to adapt to new wire harness engineering technologies and processes. Many enterprises rely on systems created in-house, with each tool being structured to support a very specific design/build process. Departments and divisions responsible for defining the electrical content of vehicles and integrating the electrical systems have one of the most demanding jobs in vehicle design.  While these organizations are often understaffed relative to the scope of their task, they have the distinction of being expected to manage the highest number and rate of design changes. Companies, especially OEMs, are finding it difficult to adopt new wire harness technologies and processes while maintaining the quality of their deliverables. Until recently, electrical system and wire harness development tools have not been viewed as an adequate solution for developing complex electrical wiring systems. Now aircraft systems and wiring designs are making a transition from traditional mechanical and pneumatic systems to electrical, and the entire electrical architecture of the vehicle is becoming more complex. Companies are finding that their existing solutions do not provide the needed engineering capability. But powerful new technologies are emerging and many companies are taking another look.  Entrenched beliefs are changing.

Is There an Easy Way to Cut the Cost of EWIS Compliance?

June 2, 2010

Aircraft Electrical Wiring Interconnect Systems (EWIS) regulatory requirements are stringent and can be expensive to fulfill. Specifications encompass harness naming conventions, physical wire spacing, and much more. While manual design approaches have long sufficed, increasing complexity is driving an industry-wide move to automated design solutions. By applying rules and constraints, commercial off-the-shelf tools can help designers manage complex system designs while simultaneously building databases for compliance, manufacturing, and maintenance documentation.

Taking Wiring Design to the Next Level

June 2, 2010

In this paper, the problem of wiring complexity that confronts electronic and electrical (EE) design engineers in the automotive, trucks and off-road industries will be discussed. The forces driving growing complexity in designs will be identified, including the pace of technological advancement, increasing legislative safety and environmental mandates, and escalating consumer demand. The consequences of escalating complexity for automotive EE designs and total manufacturer product cost will be analyzed. Areas needing improvement in current practices will be suggested and a suite of tools focused on the design-to-build-and-service flow will be described. Transportation platforms such as automobiles, trucks and off-road vehicles have contained electrical systems for decades. However, the last few years have seen a discontinuity in the nature of these electrical systems. Rapid growth in on-board electronic content and embedded software is putting huge demands on electrical design complexity. Put simply, the number of signals flowing around each vehicle is rising rapidly. Naturally this has a profound effect on harness design and construction.

Electrical and Mechanical Integration in Automotive and Aerospace Design

June 2, 2010

This paper addresses the issue of increasing complexity of today's automotive and aerospace electrical systems. Manufacturers now seek a high degree of integration between their business and design tools.  MCAD, ECAD, PLM, PDM, Workflow and ERP systems are no longer selected purely through their individual functionalities, they must also integrate - and the integration must include all data in the process

Accelerating Wire Harness Development for Off-Highway Vehicles

June 2, 2010

Manufacturers of off-highway vehicles are faced with the same challenges as companies in other sectors reducing design and manufacturing costs, reducing lead times, and improving product quality. Today, many of these companies create their electrical and wire harness designs using basic drawing packages. This paper describes how off-highway vehicle manufacturers can gain significant productivity and quality improvements in their electrical design process by using dedicated electrical design software tools.

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Mil & Aero Magazine

April 2014
Volume 25, Issue 4
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