Hey! It’s getting HOT in here!
As you look to leverage the latest in high-performance processors, you also are looking at significantly higher heat loads. There are several ways to manage these thermal loads but some add expense, others increase size and weight, and some cause maintenance headaches. As a result, board-level and chassis heat dissipation is a real challenge for the military embedded system designer.
This whitepaper examines several of the cooling techniques that people are implementing and highlights the pluses and minuses of each. It also lays out some new innovations that help you manage thermal loads at both the board and chassis level.
This White Paper brought to you by Mercury Systems.
Innovations in Thermal Management
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