Providing the most capable rugged COTS products for demanding environments

file

The latest generation of processors, GPUs, switch fabrics, and memory has placed more computing power into the hands of the designer. The improved performance has come with the challenge of higher power and higher power density for the designer to manage. This white paper will discuss the thermal challenges, as well as explore the next generation thermal solutions available to maximize the performance for applications.

This White Paper brought to you by GE Intelligent Platforms.

Format: application/x-download PDF
File Size: 1,299Kb

To access this White Paper, you may need to disable your pop-up blocker. PDF will launch in a new window or tab after clicking the "Submit" button.